Electronic device and method of manufacturing electronic device
a manufacturing method and electronic technology, applied in the direction of electronic components association, semiconductor/solid-state device details, instruments, etc., can solve the problems of difficult to completely block moisture and tendency for corrosion to progress, so as to and prevent the occurrence of corrosion
Active Publication Date: 2018-09-11
SEIKO INSTR INC
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
The present invention prevents corrosion by blocking the permeation of moisture between a through electrode and an insulating base substrate. Additionally, using tin or a tin alloy as the second electrolytic plating film reduces stress and makes it easier to solder. This results in a more durable and reliable product.
Problems solved by technology
When the external electrode 160 is formed of a conductive adhesive such as a silver paste, it is difficult to completely block moisture due to an insufficient humidity resistance of the conductive paste.
Since a gold thin film is not likely to be formed in the low melting point glass by an electroless plating method, a boundary portion between the through electrode 121 and the first metal film 122 is exposed, and thus there is a tendency for corrosion to progress.
Method used
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Embodiment Construction
[0029]FIG. 1 is a schematic cross-sectional view of an electronic device 1 according to the present invention. The electronic device 1 includes a base substrate 2, a lid 6 which is bonded thereto, and an electronic element 5 which is accommodated therein. The base substrate 2 has an insulation property and includes a plurality of through electrodes 3 which pass through the base substrate from one surface US to the other surface LS. A wiring electrode 8 is formed on one surface US of the base substrate 2 so as to cover end faces of the through electrodes 3, and an electronic element 5 is mounted on the wiring electrode 8 through a metal bump 10. The lid 6 has a dent in the center thereof, accommodates the electronic element 5 in the dent thereof, and is bonded to one surface US of the base substrate 2 through a bonding material 9. The electronic device 1 further includes external electrodes 13 each of which covers a region ranging from the end face of the through electrode 3 which is...
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An electronic device includes an insulating base substrate having a through electrode, an electronic element provided on one surface of the insulating base substrate and connected to the through electrode, a lid provided on the one surface of the insulating base substrate, and an external electrode covering an end face of the through electrode that is exposed on another surface of the insulating base substrate different from the one surface thereof. The external electrode has a conductive film, a first electrolytic plating film provided on the conductive film, and a second electrolytic plating film provided on the first electrolytic plating film. The conductive film is provided on the exposed end face of the through electrode and on portions of the another surface of the insulating base substrate in the vicinity of the exposed end face of the through electrode.
Description
BACKGROUND OF THE INVENTION[0001]Field of the Invention[0002]The present invention relates to an electronic device that accommodates an electronic element in a package, and a method of manufacturing an electronic device.[0003]Background Art[0004]Hitherto, surface-mounted electronic devices have generally been used for mobile phone and mobile information terminals. Meanwhile, in crystal vibrators, micro electro mechanical systems (MEMS), gyroscopes, acceleration sensors, and the like, a hollow cavity is formed inside a package, and an electronic element such as a crystal vibrator and a MEMS is enclosed in the cavity. A glass material is used as the package. For example, the electronic element is mounted on a base substrate, and a glass lid is bonded thereto by anodic bonding, thereby sealing the electronic element. Anodic bonding between glass materials has the advantages of high air tightness and low costs (JP-A-2011-155506).[0005]FIG. 6 is a cross-sectional view of this type of ele...
Claims
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IPC IPC(8): H05K1/11H05K3/46H05K3/00H05K1/18H05K1/09H05K3/40B81B7/00H05K1/03H05K3/10H01L23/055
CPCH05K1/09B81B7/007H05K3/4007H05K3/4046H05K2201/10287H01L23/055H01L2224/16225H01L2224/16227H01L2924/00014H01L2924/16152H05K1/0306H05K1/181H05K3/108H05K2201/0338H05K2201/0347H01L2224/0401
Inventor KOZUKI, ATSUSHIHAMADA, HIDESHIYOSHIDA, YOSHIFUMI
Owner SEIKO INSTR INC