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Semiconductor package having reflective layer with selective transmittance

a technology of selective transmittance and semiconductor devices, which is applied in the direction of semiconductor/solid-state device testing/measurement, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problem that x-ray exposure may itself degrade the characteristics of semiconductor devices

Active Publication Date: 2021-01-19
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This design effectively prevents the deterioration of semiconductor chips during defect inspection by reducing soft X-ray transmittance and enhancing the design freedom and mechanical strength of the package, while also protecting the reflective layer from corrosion and laser marking.

Problems solved by technology

However, the X-ray exposure may itself degrade the characteristics of the semiconductor device due to leakage of electric charge.

Method used

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  • Semiconductor package having reflective layer with selective transmittance
  • Semiconductor package having reflective layer with selective transmittance
  • Semiconductor package having reflective layer with selective transmittance

Examples

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Embodiment Construction

[0018]A semiconductor package according to some exemplary embodiments of the present inventive concept will be described below with reference to FIGS. 1 to 5.

[0019]FIG. 1 is a perspective view illustrating the semiconductor package according to some exemplary embodiments of the present inventive concept. FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1.

[0020]Referring to FIGS. 1 and 2, the semiconductor package according to some exemplary embodiments of the present inventive concept may include a semiconductor package substrate 101, an external connection terminal 103, a semiconductor chip 110, and a molding layer. The molding layer may include an insulating layer 121 and an auxiliary film. The auxiliary film may include a reflective layer 131 and a first protective layer 133.

[0021]The semiconductor package substrate 101 may be a package substrate, and may be, for example, a printed circuit board (PCB) or a ceramic substrate. In some exemplary embodiments of the pres...

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Abstract

A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.

Description

[0001]This application claims the benefit of Korean Patent Application No. 10-2018-0029714, filed on Mar. 14, 2018 in the Korean Intellectual Property Office, the disclosure of which is herein incorporated by reference in its entirety.TECHNICAL FIELD[0002]The present disclosure relates to a semiconductor package, and more specifically, to a semiconductor package having a reflective layer with selective transmittance.DISCUSSION OF THE RELATED ART[0003]During the manufacturing process, semiconductor devices may undergo a defect inspection procedure to detect any potential defects in the device. X-rays are generally used during defect inspection. However, the X-ray exposure may itself degrade the characteristics of the semiconductor device due to leakage of electric charge.[0004]The X-rays used for defect inspection may include both hard X-rays, which have a shorter wavelength and an energy greater than 10 keV, and soft X-rays, which have a longer wavelength and an energy generally wit...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L23/552G01N23/18
CPCH01L23/552G01N23/18H01L23/3128H01L23/3135H01L22/30H01L21/565H01L2224/16227H01L2924/15311H01L24/13H01L24/16H01L2224/13025H01L24/48H01L2224/48227H01L2924/3025H01L2224/32245H01L2224/73253H01L2224/32014H01L2224/32013H01L24/32H01L2924/181H01L23/4334H01L2224/131H01L2924/014
Inventor LEE, KUN SILKIMKANG, BO RAMSONG, HO GEONKIM, WON KEUN
Owner SAMSUNG ELECTRONICS CO LTD