Intergranular degradation assessment via random grain boundary network analysis
a random grain boundary network and analysis technology, applied in the direction of mechanical measuring arrangements, force measurement by measuring optical property variation, instruments, etc., can solve the problems of merely increasing the ratio, not enough to improve the properties, and the probabilistic nature of the approach proposed, and not fully incorporating the possible correlations that exist in the grain boundary network
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example 1
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[0036] An Inconel 600 alloy bar, with the measured impurity concentration as listed in Table 1, was used for the strain-recrystallization (SR) processes.
2TABLE 1 Elemental analysis for Inconel 600 Inconel 600 Concentration Element (wt %) Ni 74.650 Cr 16.20 Mn 0.240 Si 0.280 Ti 0.20 Cu 0.010 Fe 8.0 S 0.0020 P 0.0070 Al 0.190 Co 0.050 B 0.0010 C 0.0640
[0037] In the case of Inconel 600 alloy the series of optimization treatments induced a thickness reduction of 20% per rolling sequence. The bar was annealed at 1000 degrees C for 15 minutes in air followed by water quenching. A similar sequence of straining followed by high temperature-short time annealing was performed a total of seven times. EBSD patterns observations were made after step number 1, 3, 4, 5, and 7 for a total of six observations including the as-received condition.
[0038] The break-up of the random boundary network as a function of sequential processing conditions may be seen from the RGBNC maps shown in FIGS. 2A-2C. ...
example 2
[0039] Example 2--Oxygen-free Electronic (ofe) Copper
[0040] A Hitachi C10100 (99.99%) Cu bar, with the measured impurity concentration as listed in Table 2, was used for the strain-recrystallization (SR) processes.
3TABLE 2 Elemental analysis for ofe-Cu Oxygen-free electronic (ofe) copper Concentration Element (p.p.m.) H 0.90 C 5.0 O 6.0 Si 0.20 P 0.4 S 4.0 Fe 2.0 Ni 1.0 As 0.40 Se 0.30 Ag 6.40 Sb 0.30 Pb 0.20
[0041] The ofe Cu was subjected to three cycles of strain-recrystallizatio-n (SR): compression to 20% strain followed by annealing. Annealing was for ten minutes at temperatures of 560 or 800 degrees C., in a box-type furnace in air.
[0042] FIGS. 3A, 3B show RGBNC maps for annealing temperatures of 560 degrees C. (FIG. 3A), and 800 degrees C. (FIG. 3B). Comparing FIGS. 3A and 3B, one can see the beneficial effects of the sequential process that were exhibited at 560 degrees C. were negated as the annealing temperature was raised to 800 degrees C. (about 0.8 T.sub.m, where T.sub.m...
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