Thin film dielectrics with perovskite structure and preparation thereof

a thin film dielectric and perovskite technology, applied in the field of perovskiterelated materials, can solve the problems of binary metal oxide breaking down to form undesirable metal oxides, increasing production costs, and formation of intermediate oxides, and achieves the effects of reducing production costs, preventing or reducing oxide diffusion into the substrate, and increasing thermodynamic stability

a thin film dielectric and perovskite technology, applied in the field of perovskiterelated materials, can solve the problems of binary metal oxide breaking down to form undesirable metal oxides, increasing production costs, and formation of intermediate oxides, and achieves the effects of reducing production costs, preventing or reducing oxide diffusion into the substrate, and increasing thermodynamic stability

US20050136292A1Inactive Publication Date: 2005-06-23CABOT CORP

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] A method of making a ternary oxide according to the present invention preferably includes reacting a binary oxide with a metal oxide to form a ternary oxide dielectric layer on a substrate, wherein the metal oxide is different from the binary oxide. The method alternatively includes reacting a binary oxide with a metal hydroxide and / or metal carbonate to form a ternary oxide dielectric layer on a substrate. Other metal materials can be used. In the present invention, more than one type of metal material can be used, and / or more than one type of binary oxide can be used.

[0023] For purposes of the present invention, a ternary oxide is any three element containing compound that is an oxide, for example, LiNbO3, KNbO3, KTaO3, BaTiO3, NaNbO3, NaTaO3, combinations thereof, and the like. It can be represented by the formula, for example, AMO3, where A can be at least one alkali metal or alkaline earth metal and M is at least one metal. The perovskite-related ternary oxide may also ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
temperatureaaaaaaaaaa
pressureaaaaaaaaaa
temperatureaaaaaaaaaa
Login to View More

Abstract

Methods of making a ternary oxide and a perovskite-related ternary oxide structure are described. The methods include reacting a binary oxide with a metal oxide or a metal hydroxide to form a ternary oxide dielectric layer on a substrate. Powders, anodes, pressed articles, and capacitors including the ternary oxide or perovskite-related ternary oxide structure as a dielectric layer or other layers are further described.

Description

[0001] This application claims the benefit under 35 U.S.C. §119(e) of prior U.S. Provisional Patent Application No. 60 / 495,220 filed Aug. 14, 2003, which is incorporated in its entirety by reference herein.BACKGROUND OF THE INVENTION [0002] The present invention relates to perovskite-related materials and methods to make a perovskite-related structure, as well as to methods of making ternary oxide dielectric films and capacitors and other devices containing the films. [0003] Dielectric films or layers are used in a variety of applications, such as anode production and capacitors. Typically, dielectric films comprised of binary metal oxides, such as Ta2O5 and Nb2O5, are formed on a metal substrate creating a metal-metal oxide interface. However, when using binary metal oxides, such as Ta2O5 and Nb2O5, the binary metal oxide can break down to form undesirable metal oxides, such as NbO2, which can then diffuse across the interface into the metal anode, for instance. This is especially ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
23 Jun 2005
Publication
US20050136292A1
IPC
C01G1/02; C01G33/00; C01G35/00; H01G4/12; H01L21/316
CPC
C01G1/02; C01G33/006; C01G35/006; C01P2002/34; H01L21/31691; C01P2004/80; C01P2006/32; C01P2006/40
Inventors
MARIANI, ROBERT D.; KOENITZER, JOHN W.