Thermoset adhesive films

a technology of thermoset adhesive and film, which is applied in the direction of film/film adhesive, non-macromolecular adhesive additive, adhesive type, etc., can solve the problems of the least efficient step in the total assembly manufacturing process of wirebonded integrated circuit packages, the ultimate latency of epoxy adhesives, and the speed of cure for these compositions

Inactive Publication Date: 2005-06-23
NIKOLIC NIKOLA A +5
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One drawback to epoxy adhesives is their ultimate latency.
Moreover, the speed of cure for these compositions is relatively slow making the die-attach operation the least efficient step in the total assembly manufacturing process for wirebonded integrated circuit packages.

Method used

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  • Thermoset adhesive films
  • Thermoset adhesive films
  • Thermoset adhesive films

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0027] This example discloses a butadiene / acrylo-nitrile base polymer containing pendant acrylate (electron acceptor) functionality.

where x=50, y=5, n=310, p=678, and q=59, based on GPC and NMR analysis (one skilled in the art will recognize that these values may vary slightly due to the polymeric character of the material).

[0028] Carboxylated butadiene / acrylonitrile polymer (50.6 g) (Nipol 1072 from Zeon Chemicals) was solvated in 4-methyl-2-pentanone (MIBK, 250 mL) in a 500 mL four-necked flask equipped with a mechanical stirrer, condenser and drying tube. Glycidyl methacrylate (9.78 g) and tetrabutylphosphonium acetate solution (0.58 g) (TBPAAC, catalyst, 70% by weight of tetrabutylphosphonium acid acetate in methanol from Morton International, Inc.) were added to the mixture with stirring. The mixture was heated to 110° C. and held at that temperature for approximately twelve hours. The final product has a viscosity of 4870 mPa·s at ambient temperature and according to titra...

example 2

[0029] This example discloses a butadiene / acrylonitrile base polymer with pendant styrenic (electron donor) functionality,

where x=56, y=16, n=401, p=877, and q=76 based on GPC and NMR analysis (one skilled in the art will recognize that these values may vary slightly due to the polymeric character of the material).

[0030] Carboxylated butadiene / acrylonitrile polymer (38.0 g) (Nipol 1072 from Zeon Chemicals) was solvated in 4-methyl-2-pentanone (MIBK, 255 mL) in a 500 mL four-necked flask equipped with a mechanical stirrer, condenser and drying tube. Isoeugenol glycidyl ether (11.43 g) and tetrabutyl-phosphonium acetate solution (0.62 g) (TBPAAC, catalyst, 70% by wetight of tetrabutylphosphonium acid acetate in methanol from Morton International, Inc.) were added into the mixture with stirring. The mixture was heated to 110° C. and held at that temperature for approximately fourteen hours. According to titration results of the residual carboxylic acid of the modified Nipol rubber,...

example 3

[0031] This example discloses a butadiene / acrylonitrile base polymer with pendant styrenic (electron donor) functionality,

where x=49, y=7, n=310, p=739, and q=59 based on GPC and NMR analysis (one skilled in the art will recognize that these values may vary slightly due to the polymeric character of the material).

[0032] Carboxylated butadiene / acrylonitrile polymer (53.8 g) (Nipol 1072 from Zeon Chemicals) was solvated in 4-methyl-2-pentanone (MIBK, 360 mL) in a 1 L four-necked flask equipped with a mechanical stirrer, condenser and drying tube. Glycidyl N-(3-isopropenyl-α,α-dimethylbenzyl) carbamate (14.8 g) and tetrabutylphosphonium acetate solution (0.54 g) (TBPMC, catalyst) were added into the mixture with stirring. The mixture was heated to 105° C. and held at that temperature for approximately fifteen hours. The final product has a viscosity of 2000 mPa·s at ambient temperature and according to titration results, the carboxyl conversion is about 88%. According to GPC analys...

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Abstract

This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

Description

[0001] This application is a continuation-in-part of Ser. No. 10 / 146,387 filed 14 May 2002.FIELD OF THE INVENTION [0002] This invention relates to film adhesives, and particularly film adhesives for use in semiconductor packaging. BACKGROUND OF THE INVENTION [0003] A common mode of electronics packaging involves affixing semiconductor devices onto substrates by means of an adhesive tape. Epoxy compounds and resins currently are among the most commonly used materials for current film based adhesive applications, such as die attach, in which a semiconductor die is attached to a substrate. In a typical embodiment, a film-forming rubber polymer is blended with epoxy resins and a hardening agent. These compositions can then be cured upon application of heat, which results in the development of a thermoset network. One drawback to epoxy adhesives is their ultimate latency. Typically, these materials must be stored at low temperature to avoid premature advancement of the adhesive. Moreover...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09J7/00C08L25/00C08L33/00C08L55/00C09J5/10C09J11/06C09J109/02C09J125/08C09J133/00C09J133/20C09J157/00C09J201/00C09J201/02
CPCC08F267/10C08L25/00C08L33/00C08L55/00C09J5/10C09J11/06C09J2455/00C09J2205/114C09J2425/00C09J2433/00C09J2301/414C09J109/02C09J125/08C09J133/20C09J157/00C09J201/00
Inventor NIKOLIC, NIKOLA A.ZHANG, RUZHIMUSA, OSAMA M.JIN, HWAILWU, BINGSHENFIELD, DAVID
Owner NIKOLIC NIKOLA A
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