Purged vacuum chuck with proximity pins

a vacuum chuck and proximity pin technology, applied in the field of vacuum chuck with proximity pins, can solve the problems of particulate contaminants entering the process environment, defects in the circuitry fabricated on the substrate, etc., and achieve the effects of reducing the time of substrate transition, reducing the proximity of height, and increasing the thermal transfer rate of energy

US20060130767A1Inactive Publication Date: 2006-06-22SOKUDO CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
Publication Date
2006-06-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

A substrate support structure comprising a first surface and a second surface opposite the first surface. The substrate support structure also comprises a plurality of proximity pins projecting to a first height above the first surface, the first height being less than 100 μm. In addition, the substrate support structure further comprises a plurality of purge ports passing from the second surface to the first surface and a plurality of vacuum ports passing from the second surface to the first surface. In one embodiment, the plurality of purge ports are arranged in a first circular pattern, the first circular pattern having a first radial dimension less than the radius of the substrate support, and the plurality of vacuum ports are arranged in a second circular pattern, the second circular pattern having a second radial dimension less than the first radial dimension.
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Description

CROSS-REFERENCES TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application Ser. No. 60 / 639,109, filed Dec. 22, 2004, entitled “Twin Architecture For Processing A Substrate,” which is incorporated herein by reference.BACKGROUND OF THE INVENTION

[0002] The present invention relates generally to the field of semiconductor processing equipment. More particularly, the present invention relates to a method and apparatus for supporting a substrate inside a semiconductor processing chamber. The method and apparatus can be applied to electrostatic chucks, vacuum chucks, and other applications as well.

[0003] Substrate support chucks are widely used to support substrates within semiconductor processing systems. Two examples of particular types of chucks used in semiconductor processing systems include electrostatic chucks (e-chucks) and vacuum chucks. These chucks are used to retain semiconductor wafers, or other workpieces, in a stationary position du...

Examples

Embodiment Construction

[0021] According to the present invention, methods and apparatus related to semiconductor manufacturing equipment are provided. More particularly, embodiments of the present invention relate to a method and apparatus for supporting a substrate during semiconductor processing operations. The method and apparatus can be applied to electrostatic chucks, vacuum chucks, and other applications as well.

[0022]FIG. 1 is a simplified schematic side view illustration of a substrate processing chamber according to one embodiment of the present invention. In the embodiment illustrated in FIG. 1, the assembly 180 contains a plate assembly 170 and a vacuum source 175, which are mounted in a processing module 186. The plate assembly 170 generally contains a plate 170B, plate assembly surface 170A, protrusions 171, and a vacuum source port assembly 172. In this configuration the vacuum source 175 is used to create a negative pressure in the vacuum port plenum 172B, thus causing air to flow into a n...