Method and apparatus for forming substrate for semiconductor or the like
a technology of semiconductor or the like, applied in the direction of polarisation-affecting properties, instruments, measurement devices, etc., can solve the problems of inability to accurately specify the characteristics of the thin film in the prior art, and the difficulty of determining the important optical characteristics of the thin film,
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[0036] An embodiment according to the present invention will now be described hereinafter with reference to the accompanying drawings.
[0037]FIG. 1 shows an example of a laser annealing apparatus as an example of a substrate finishing / processing apparatus in which an apparatus which determines characteristics of a semiconductor thin film according to an embodiment of the present invention is incorporated.
[0038] The apparatus 1 which determines characteristics of a semiconductor thin film is integrally incorporated at a predetermined position of, e.g., a laser annealing apparatus 101 which is an example of a substrate finishing / processing apparatus holding a substrate S as a target whose characteristics should be determined for finishing / processing, which is a rear surface side of the substrate S in the example of FIG. 1. It is to be noted that each of the apparatus 1 which determines characteristics of the thin film and the laser annealing apparatus 101 is operated in a vacuum cont...
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