Electroform, methods of making electroforms, and products made from electroforms
a technology of electroforms and electroforms, applied in the field of electroforms and methods for forming electroforms, can solve the problems of difficult to manufacture masters, difficult to produce masters, and bright or very dark spots on display
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example 1
Passivation in a Caustic Solution with Anodic Current
[0081] Sample 1, a nickel sub-master electroform having a microstructure comprising a plurality of channels and grooves of about 1 μm to about 37 μm in depth, was passivated by immersion into an aqueous solution for 4 minutes at 25° C. while applying an anodic current density of 4 ASF. The aqueous solution comprised 20 g / l potassium hydroxide and 0.5 g / l sodium lauryl sulfate and had a pH of 13.5. The sub-master was removed, rinsed with deionized water, and then dried. The sub-master was then plated with a nickel-cobalt (NiCo) alloy by electroforming a layer that was about 100 μm in thickness. After electroforming, the plated sub-master was rinsed and dried, and the nickel-cobalt electroform was readily peeled from the sub-master, showing complete removal and no visible damage to the microstructures when examined under a microscope at up to 40×. It is also noted that samples have been examined to a magnification of 100×X without ...
example 2
Passivation in a Caustic Solution with Anodic Current
[0082] Sample 2, a nickel sub-master electroform having a microstructure comprising a plurality of channels and grooves of about 1 μm to about 37 μm in depth, was passivated by immersion into an aqueous solution for 4 minutes at 35° C. while applying an anodic current density of 4 ASF. The aqueous solution comprised 20 g / l of StamperPrep (a high alkalinity (pH greater than 13), low foaming, cleaning agent comprising sodium hydroxide commercially available from DisChem, Inc., Ridgway, Pa.), and had a pH of greater than 13.5. The sub-master was removed, rinsed with deionized water, and then dried. The sub-master was then plated with a nickel-cobalt alloy by electroforming a layer that was about 100 μm in thickness under the same conditions as in Example 1. After electroforming, the plated sub-master was rinsed and dried, and the nickel-cobalt electroform was readily peeled from the sub-master, showing complete removal and no visibl...
example 3
Passivation of a Nickel Containing Sub-master
[0083] Sample 3, a nickel sub-master electroform having a microstructure comprising a plurality of channels and grooves of about 1 μm to about 37 μm in depth, was passivated by immersion into an aqueous solution for 30 seconds at 35° C. while applying an anodic current density of 35 ASF. The aqueous solution comprised 90 g / l of StamperPrep, and had a pH of greater than 13.5. The sub-master was removed, rinsed with deionized water, and then dried. The sub-master was then plated with a nickel-cobalt alloy by electroforming a layer that was about 100 μm in thickness under the same conditions as in Example 1. After electroforming, the plated sub-master was rinsed and dried, and the nickel-cobalt electroform was readily peeled from the sub-master, showing complete removal and no visible damage to the microstructures when examined under a microscope.
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