Methods and apparatus for selectively coupling process tools to abatement reactors

Abstract

In certain embodiments, an apparatus is provided for use in removing pollutants from a gas stream. The apparatus may include one or more thermal reaction units formed from a plurality of stacked porous ceramic rings. The thermal reaction units may be selectively coupled to one or more process tools. In some embodiments a manifold may be used to direct waste effluent toward online primary thermal reaction units and away from back-up thermal reaction units. If a primary thermal reaction unit goes off-line, the manifold may redirect waste effluent toward one or more of the back-up thermal reaction units. Numerous other aspects are provided.

Description

[0001] The present application claims priority from U.S. Provisional Patent Application Ser. No. 60 / 731,719, filed Oct. 31, 2005, which is hereby incorporated by reference herein in its entirety.FIELD OF THE INVENTION [0002] The present invention relates to improved systems and methods for the abatement of industrial effluent fluids, such as effluent gases produced in semiconductor manufacturing processes, while reducing the deposition of reaction products in the abatement systems. BACKGROUND [0003] The gaseous effluents from the manufacturing of semiconductor materials, devices, products and memory articles involve a wide variety of chemical compounds used and produced in the process facility. These compounds include inorganic and organic compounds, breakdown products of photo-resist and other reagents, and a wide variety of other gases that must be removed from the waste gas before being vented from the process facility into the atmosphere. [0004] Semiconductor manufacturing proce...

AI Technical Summary

Benefits of technology

The patent describes a thermal reaction unit used in a semiconductor manufacturing process to remove gaseous waste. The unit has an interior porous wall with multiple porous sections, a waste gas inlet, and a thermal mechanism. The fluid delivery system provides a fluid to the interior porous wall at a sufficient force to prevent the reaction products from depositing on the wall. The apparatus and method of the patent allow for efficient removal of gaseous waste during the manufacturing process.

Problems solved by technology

Semiconductor manufacturing processes utilize a variety of chemicals, many of which have extremely low human tolerance levels.

Halogens, e.g., fluorine (F2) and other fluorinated compounds, are particularly problematic among the various components requiring abatement.

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