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Method for preparing microstructured laminating adhesive articles

a technology of adhesive articles and laminating adhesives, applied in the direction of film/foil adhesives, other domestic articles, transportation and packaging, etc., can solve the problems of stress introduced into the adhesive, adversely affecting the optical properties of the adhesive, etc., and achieves low opacity, low haze, and high luminous transmittance.

Active Publication Date: 2007-09-13
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0004] A method of making a microstructured adhesive article is described that includes (a) providing an article comprising a crosslinked pressure sensitive adhesive layer disposed on a backing; and (b) embossing the surface of the crosslinked pressure sensitive adhesive layer to form a crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface. Emboss means, for the purpose of the present application, deforming with pressure. In some embodiments, the crosslinked adhesive surface is embossed by contacting the surface with a microstructured release liner. In other embodiments, the crosslinked adhesive surface is embossed by contacting the surface with a microstructured molding tool. The resulting articles may be dry laminated to a variety of substrates, including rigid substrates such as glass, and are particularly useful for optical applications where low haze, low opacity, and high luminous transmittance are desirable.
[0005] Embossing the surface of a crosslinked pressure sensitive adhesive to create a microstructured adhesive surface minimizes the formation of stresses within the adhesive after lamination because both the pre-structured and final states of the adhesive are substantially planar. Therefore, the structure is unstable when not in contact with the microstructured liner or molding tool. This is in contrast to microstructured adhesives produced by coating a flowable adhesive onto a microstructured release liner or a microstructured molding tool, where the initial state of the adhesive to which it tries to return is that of the microstructured configuration, while the final state is substantially planar.

Problems solved by technology

In the process, however, stresses are introduced into the adhesive as the adhesive relaxes and tries to return to its initial microstructured state.
These stresses can create defects in the adhesive that adversely affect its optical properties.

Method used

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  • Method for preparing microstructured laminating adhesive articles

Examples

Experimental program
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Effect test

examples

[0036] These examples are merely for illustrative purposes only and are not meant to be limiting on the scope of the appended claims. All parts, percentages, ratios, etc. in the examples and the rest of the specification are by weight, unless noted otherwise. Solvents and other reagents used were obtained from Sigma-Aldrich Chemical Company; Milwaukee, Wis. unless otherwise noted.

Table of AbbreviationsAbbreviationor TradeDesignationDescriptionAdhesive3M Optically Clear Adhesive 8141, adhesive thicknessLaminate-125 micrometers (1 mil) between 2 release liners, usedas obtained. Commercially available from 3M Company,St. Paul, MN.Adhesive3M Optically Clear Adhesive 8142, adhesive thicknessLaminate-251 micrometers (2 mils) between 2 release liners,used as obtained. Commercially available from 3MCompany, St. Paul, MN.Adhesive3M Paint Protection Film 84824, adhesive thicknessLaminate-351 micrometers (2 mils) between a paper release linerand a urethane film, used as obtained. Commerciall...

example 1

[0042] For Example 1 a sample of Adhesive Laminate-2 was obtained and one liner was removed and Liner-2 was laminated to the PSA using a laminator. Liner-2 was removed to determine whether the structure had embossed into PSA-1 surface. The embossed surface was placed in contact with a glass plate and pressure was applied with a simple finger rub-down to one half of the sample and the other half of the sample was left untouched. The rubbed portion showed complete wet out as viewed by the eye.

example 2

[0043] The same procedure described for Example 1 was followed except that Adhesive Laminate-2 was used. Tape samples were prepared from the sample of Adhesive Laminate-1 by removing one liner, laminating to a 127 micrometer (5 mil) polyethylene terephthalate film and then removing the other liner and laminating Liner-2 to this construction. 180° Peel Adhesion was measured as described in the Test Method above, immediately after adhesion to the glass plate or after a 24 hour dwell on the glass plate. The results are shown in Table 1. Rebound Testing of a tape sample was made. The results are shown in Table 2 and graphically in FIG. 1.

TABLE 1180° Peel Adhesion180° Peel Adhesion AfterExampleInitial (N / dm)24 Hour Dwell (N / dm)C1606024862

[0044]

TABLE 2Elapsed TimeFeature Depth(hours)(Micrometers)07.824.8242.7302.2482.0721.9961.81681.3

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Abstract

A method of making a microstructured adhesive article that includes (a) providing an article comprising a crosslinked pressure sensitive adhesive layer disposed on a backing; and (b) embossing the surface of the crosslinked pressure sensitive adhesive layer to form a crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface.

Description

TECHNICAL FIELD [0001] This invention relates to methods for making microstructured laminating adhesive articles. BACKGROUND [0002] Microstructured adhesive articles have been prepared by applying a flowable pressure sensitive adhesive to the surface of a microstructured release liner or the surface of a microstructured molding tool. The process results in the creation of an adhesive having a microstructured surface. When the resulting articles are dry laminated under pressure to substrates such as glass or polymer films, the microstructural features created in the adhesive surface allow air to escape from the bonding interface, thereby minimizing or preventing the formation of bubbles and pinholes. [0003] During lamination, the microstructural features flatten out and wet the substrate surface under the influence of applied pressure. In the process, however, stresses are introduced into the adhesive as the adhesive relaxes and tries to return to its initial microstructured state. T...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B7/12B05D5/10C09J7/38
CPCB32B27/08Y10T428/28B32B37/12B32B38/06C09J7/0207C09J7/0232C09J2201/28B32B27/308B32B2307/412B32B2405/00B32B2551/00B32B2605/006B32B17/10036B32B17/10587B32B17/10743B32B17/10697B32B37/003C09J7/38C09J7/403C09J2301/204B32B7/12B29C59/022B29C2059/023B29K2995/0026B32B37/26B32B2037/268
Inventor SHERMAN, AUDREY A.WINKLER, WENDI J.MAZUREK, MIECZYSLAW H.GARCIA, HENRITORO, DANIEL
Owner 3M INNOVATIVE PROPERTIES CO
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