Apparatus and method of fabricating thin film pattern

US20070295688A1Inactive Publication Date: 2007-12-27LG DISPLAY CO LTD

Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
LG DISPLAY CO LTD
Publication Date
2007-12-27
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A fabricating method and apparatus of a thin film pattern improves the reliability of forming the thin film pattern by a resist printing method. The apparatus includes a print roller device of a roll shape around which a blanket is wound; a spray device located around the print roller device for spraying an etch resist solution to the blanket; and a print plate of an engraved shape where a groove of a desired thin film shape and a projected part except the groove are formed, and the etch resist solution has a surfactant inclusive of an ethylene oxide fluorinated polymer material.
Need to check novelty before this filing date? Find Prior Art

Description

[0001] This application claims the priority benefit Under 35 U.S.C. §119 of the Korean Patent Application No. P06-0056739 filed on Jun. 23, 2006, which is hereby incorporated by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The invention pertains to a fabricating method of a thin film pattern of a display panel, and more particularly to a reverse resist printing device and a fabricating method of a thin film pattern using the same.

[0004] 2. Description of the Related Art

[0005] Recently, various flat panel display devices, which can reduce the weight and size that are a disadvantage of a cathode ray tube, have been on the rise. The flat panel display devices includes liquid crystal displays, field emission displays, plasma display panels, organic electro luminescence (hereinafter, referred to as ‘EL’) displays, etc.

[0006] Among these, the liquid crystal display devices control the light transmittance of liquid crystal by using an electric field, thereby displa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More