Method and apparatus for cooling integrated circuit chips using recycled power

a technology of integrated circuit chips and power, applied in the direction of lighting and heating apparatus, machine operation mode, etc., can solve the problems of increasing the density and complexity of integrated circuits (ics), increasing power consumption and heat dissipation of ics, and quickly reaching unsafe operating temperatures for power-demanding system components such as cpus or graphics processing units (gpus). , to achieve the effect of recycling wasted energy within the computer system and reducing the operating temperature of the ic chip
US20080229759A1Inactive Publication Date: 2008-09-25SUN MICROSYSTEMS INC
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
SUN MICROSYSTEMS INC
Publication Date
2008-09-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

One embodiment of the present invention provides a system that cools integrated circuit (IC) chips within a computer system. During operation, the system converts heat generated by a heat-generating-device within the computer system into thermoelectric power. The system then supplies the thermoelectric power to an IC chip as a cooling power to reduce the operating temperature of the IC chip, thereby recycling wasted energy within the computer system.
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Description

BACKGROUND

[0001] 1. Field of the Invention

[0002] The present invention relates to techniques for improving energy efficiency within computer systems. More specifically, the present invention relates to a method and an apparatus that recycles heat dissipated within a computer system and converts the heat into cooling power for integrated circuit (IC) chips within the same computer system.

[0003] 2. Related Art

[0004] Rapid advances in computing technology presently make it possible to perform trillions of operations each second on data sets as large as a trillion bytes. These advances can be largely attributed to an exponential increase in the density and complexity of integrated circuits (ICs). Unfortunately, in conjunction with this increase in computational power, power consumption and heat dissipation of ICs has also increased dramatically.

[0005] Specifically, high-end computer servers can easily generate 20 kilowatts or more heat. Consequently, some power-demanding system components, s...

Claims

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