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Water-cooling heat-dissipating system

a heat dissipating system and water-cooling technology, which is applied in the direction of positive displacement liquid engine, lighting and heating apparatus, and semiconductor/solid-state device details, etc., can solve the problems of affecting the arrangement of water-cooling, affecting the efficiency of water-cooling, and difficulty in further compressing the whole volume of the pump, so as to improve the utilization of space, reduce the space occupied by the water-cooling heat-dissipating system, and reduce the volume of the membrane pump

Inactive Publication Date: 2008-11-20
COOLER MASTER CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]In view of the above drawback, the present invention is to provide a water-cooling heat-dissipating system having a thin pump. By providing a membrane pump which uses an activating element as a power source, the volume of the membrane pump is compressed substantially and thus the space occupied by the water-cooling heat-dissipating system is reduced. Not only the utilization of the space can be improved, but also the water-cooling heat-dissipating system can be applied to more electronic products having a thinner structure.
[0008]The present invention provides a water-cooling heat-dissipating system, which includes a water block and a heat exchanger. The above-mentioned components are in fluid communication with one another via a plurality of conduits. The water block is attached on a heat-generating element to absorb the heat generated by the heat-generating element. The top surface of the water block is provided with a membrane. The membrane is provided thereon with an activating element, so that the membrane swings up and down at one side thereof to guide the flow of the working fluid. The heat exchanger performs a heat-conducting action with the flowing working fluid, thereby dissipating the heat absorbed by the working fluid to the outside. In this way, the heat-generating element can be kept in a normal range of working temperature.

Problems solved by technology

Since the required power of electronic elements and semiconductors contained therein becomes larger and larger, the electricity consumption of the associated system increases substantially.
In order to reduce the excessively high temperature of the electronic element and keep the working temperature thereof stable, therefore, it is an important issue for modern technology to develop an excellent heat-dissipating solution.
However, since the functions of modern electronic products are more and more powerful, it is necessary to require various electronic elements, which inevitably occupies the accommodating space within the electronic product and also affects the arrangement of the water-cooling heat-dissipating system directly.
Therefore, it is difficult to further compress the whole volume of the pump; however, the water-cooling heat-dissipating system still occupies a certain space.
As a result, it is difficult to apply the water-cooling heat-dissipating system to a further thinner electronic product, which becomes a drawback of the water-cooling heat-dissipating system.

Method used

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fourth embodiment

[0025]With reference to FIG. 5, it is a top view of the present invention. As shown in this figure, the chamber 213 of the membrane pump 2 is provided with a valve 10 at the position corresponding to that of the inlet pipe 211. Further, a second cavity 8 is provided between the membrane pump 2 and the water tank 3. The second cavity 8 has a second chamber 81 therein. Both sides of the second cavity 8 are provided with an inlet pipe 82 and an outlet pipe 83. The inlet pipe 82 and the outlet pipe 83 are in fluid communication with the membrane pump 2 and the tank 3 via the conduits 5 respectively. Further, the interior of the second chamber 81 is provided with a valve 10a at the position corresponding to that of the inlet pipe 82. Via this arrangement, when the activating element 23 on the membrane pump 2 starts to swing downwardly, the membrane 22 is caused to compress the internal space of the chamber 213 of the membrane pump 2, thereby forcing the working fluid to flow toward the i...

fifth embodiment

[0026]FIG. 6 is a top view of showing the structure of the present invention, and FIG. 7 is an exploded view of the membrane pump. As shown in FIG. 6, the primary components of the water-cooling heat-dissipating system include a water block 1, a membrane pump 2, a water tank 3 and a heat exchanger 4. The above-mentioned primary components are in fluid communication with one another via a plurality of conduits 5, so that the working fluid can flow in the individual primary component. In the present embodiment, the water-cooling heat-dissipating system is provided on a main board 6. The water block 1 is attached on a heat-generating element (not shown) directly, thereby performing a heat-conducting action with the heat-generating element. The water block 1 is a hollow cavity. The interior of the water block 1 is provided with a plurality of heat-dissipating pieces 11 to form a plurality of flowing paths 12. The front and rear ends of the water block 1 are provided with an inlet pipe 1...

sixth embodiment

[0030]With reference to FIG. 8, it is a top view showing the structure of the present invention. In the present invention, the components of the water-cooling heat-dissipating system can be connected in series or in parallel according to various demands for heat dissipation. In addition to the previous embodiment in which the components are connected in series to form a single-circulation type water-cooling heat-dissipating system, as shown in FIG. 8, the water-cooling heat-dissipating system of the present invention can be applied to a plurality of heat-generating elements. The primary components of the water-cooling heat-dissipating system include a plurality of water blocks 1 and 1a (in the present embodiment, there are two water blocks), a membrane pump 2, a water tank 3, a heat exchanger 4, and a second cavity 8 and a third cavity 9 provided on both ends of the membrane pump 2. The water block 1 and 1a are adhered in parallel on the heat-generating elements, and then are in flu...

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Abstract

A water-cooling heat-dissipating system for facilitating a heat-dissipating action with a heat-generating element includes a water block and a heat exchanger. The above-mentioned components are in fluid communication with one another via a plurality of conduits. The water block is attached on the heat-generating element to absorb the heat generated by the heat-generating element. The top surface of the water block is provided with a membrane. The membrane is provided thereon with an activating element, so that the membrane swings up and down at one side thereof to guide the flow of the working fluid. The heat exchanger performs a heat-conducting action with the flowing working fluid, thereby dissipating the heat absorbed by the working fluid to the outside. In this way, the heat-generating element can be kept in a normal range of working temperature.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat-dissipating system, and in particular to a water-cooling heat-dissipating system in which a working fluid is used as a heat-conducting medium.[0003]2. Description of Prior Art[0004]Since the required power of electronic elements and semiconductors contained therein becomes larger and larger, the electricity consumption of the associated system increases substantially. As a result, the amount of heat generated by the electricity-controlled elements also increases to a great extent. In order to reduce the excessively high temperature of the electronic element and keep the working temperature thereof stable, therefore, it is an important issue for modern technology to develop an excellent heat-dissipating solution.[0005]As far as now is concerned, in addition to the heat-dissipating fan that is used most commonly, another common heat-dissipating solution is a water-cooling heat-dissi...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28D15/00
CPCF04B43/04F04B43/046F28D15/00H01L23/473H01L2924/0002F28F2250/08H01L2924/00
Inventor MA, HSIAO-KANGPENG, CHANG-HUNGHOU, BO-RENKUO, MING-CHIEN
Owner COOLER MASTER CO LTD