Heat diffusing device and method of producing the same

Inactive Publication Date: 2009-01-22
SONY CORP
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[0013]In the method of producing a heat diffusing device according to another embodiment of the present invention, the first and second metallic thin plates whose dimensions differ are alternately laminated, so that a groove defined by a steep wall face can be formed with good precision at the wall face defining the sealed space. When the groove is filled with the liquid, the groove can be filled with the liquid while a contact angle θ of the liquid with respect to the wall face defining the groove is small.
[0014]According to the heat dif

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As a result, grooves defined by s

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  • Heat diffusing device and method of producing the same
  • Heat diffusing device and method of producing the same

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[0050]In the heat diffusing device 21 according to the first embodiment, as shown in FIG. 6, grooves 44 defined by steep wall faces are formed at side walls of peripheral portions 28 in sealed spaces 45 in FIG. 1 due to the difference Δw between the dimensions of the first and second metallic thin plates 22 and 23. That is, the C-shaped grooves 44 defined by upper and lower wall faces that are at right angles with respect to respective back wall faces as viewed in cross section of the grooves are formed. In addition, as shown in FIGS. 7A and 7B, grooves 44 defined by steep wall faces are formed at side wall faces of respective central portions 27 in the sealed spaces 45 due to the difference Δw between the dimensions of the first and second metallic thin plates 22 and 23. That is, the C-shaped grooves 44 defined by upper and lower wall faces that are at right angles with respect to respective back wall faces as viewed in cross section of the grooves are formed. The grooves 44 are fo...

Example

[0068]In the heat diffusing device 61 according to the second embodiment, grooves 78 (see FIGS. 13A and 13B), defined by steep wall faces, are formed over the side wall faces, defining the respective sealed spaces 77 formed by the elongated openings in FIG. 12, due to the dimension difference Δw between the dimensions of the first and second metallic thin plates 62 and 63. The grooves 78 are formed into annular shapes continuously formed with the entire peripheries of the respective sealed spaces 77. Similarly to the first embodiment, as viewed from the cross section of the grooves, the grooves 78 have C shapes having upper and lower wall faces that are at right angles to respective back wall faces.

[0069]As mentioned above, it is desirable to use, for example, water (pure water) as the liquid that becomes a refrigerant.

[0070]Next, the operation of filling the interior of the heat diffusing device 61 with the liquid will be described in detail with reference to FIGS. 18 to 20. In the...

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Abstract

A heat diffusing device includes first and second metallic thin plates that are alternately laminated to each other, and that are joined along with an upper sealing metallic thin plate and a lower sealing metallic thin plate by diffusion joining so as to form a sealed space in an interior defined by the first and second thin plates and the upper and lower sealing metallic thin plates. A C-shaped groove defined by a steep wall face is formed at a wall face defining the sealed space due to a difference (Δw) between the dimensions of the first metallic thin plates and the dimensions of the second metallic thin plates.

Description

CROSS REFERENCES TO RELATED APPLICATIONS[0001]The present invention contains subject matter related to Japanese Patent Application JP 2007-188373 filed in the Japanese Patent Office on Jul. 19, 2007, the entire contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a heat diffusing device that restricts the temperature of a heat source to a temperature less than or equal to a predetermined temperature by diffusing heat of the heat source in, for example, an electronic apparatus or other apparatuses.[0004]2. Description of the Related Art[0005]Hitherto, in, for example, an electronic apparatus, such as a personal computer or a projector (display apparatus), a heat diffusing device for dissipating heat of a heat source is required. What is called a heat pipe is known as an example of the heat diffusing device. The heat pipe has, for example, the following structure. That is, for example, a...

Claims

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Application Information

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IPC IPC(8): F28F3/12
CPCF28D15/0233F28D15/0266F28F3/12Y10T29/4935H01L2924/0002H01L23/427H01L2924/00
Inventor KAWABATA, YASUO
Owner SONY CORP
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