Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multilayer ceramic electronic device and method for manufacturing the same

a multi-layer ceramic and electronic device technology, applied in the field of electronic devices, can solve the problems of difficult to satisfactorily meet the demands of protruding electrodes and prevent the mounting of high-density electronic devices on the surface, and achieve the effects of improving miniaturization, high reliability, and outstanding impact resistan

Active Publication Date: 2009-03-05
MURATA MFG CO LTD
View PDF24 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]To overcome the problems described above, preferred embodiments of the present invention provide a method for manufacturing a multilayer ceramic electronic device, wherein leakage of an underfill resin arranged to fix a surface mount electronic device does not occur and high-density, high-accuracy mounting of a device is provided, and a highly reliable multilayer ceramic electronic device which is produced by the above-described manufacturing method and which has outstanding impact resistance and improved miniaturization.

Problems solved by technology

Therefore, it is difficult to satisfactorily meet the demands for protruding electrodes (columnar electrodes) 63 having smaller diameters and high aspect ratios.
However, the resin leaks from a lower region of the semiconductor element 61 to the surrounding region because of the viscosity of the resin and the state of leakage fluctuates.
Consequently, there is a problem in that high-density mounting of surface mount electronic devices is prevented.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multilayer ceramic electronic device and method for manufacturing the same
  • Multilayer ceramic electronic device and method for manufacturing the same
  • Multilayer ceramic electronic device and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

first preferred embodiment

[0084]FIG. 1 is a sectional view showing the entire structure of a multilayer ceramic electronic device according to a preferred embodiment of the present invention.

[0085]Furthermore, FIG. 2A is an exploded perspective view showing a portion (arrangement of a seat portion on a multilayer ceramic element assembly) of the multilayer ceramic electronic device shown in FIG. 1, and FIG. 2B is a perspective view showing a state in which a semiconductor element is mounted on the seat portion. In FIGS. 2B and 2B, only the multilayer ceramic element assembly, the seat portion, and the semiconductor element are shown, and the other elements are omitted.

[0086]As shown in FIGS. 1 to 2B, a multilayer ceramic electronic device A according to the first preferred embodiment of the present invention includes a multilayer ceramic element assembly 4 including first ceramic layers 1 which define ceramic base material layers, second ceramic layers 2 which define shrinkage restriction layers which are la...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Temperatureaaaaaaaaaa
Login to View More

Abstract

In a method for manufacturing a multilayer ceramic electronic device, a resin introduction portion located outside a vertically projected region of a surface mount electronic device is disposed on a seat portion which includes a non-metallic inorganic powder as a primary component and on which the surface mount electronic device, e.g., a semiconductor element, is mounted, and a resin is supplied to the resin introduction portion so as to fill the resin into the seat portion and a gap between the seat portion and a multilayer ceramic element assembly. Unsintered ceramic base material layers and shrinkage restriction layers arranged to restrict shrinkage of the unsintered ceramic base material layers in a direction substantially perpendicular to a thickness direction of the unsintered ceramic base material layers are laminated and, thereby, an unfired multilayer ceramic element assembly is formed, which does not shrink in a direction substantially perpendicular to a lamination direction in a firing step.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an electronic device and a method for manufacturing the same. In particular, the present invention relates to a multilayer ceramic electronic device in which a surface mount electronic device is mounted on a multilayer ceramic element assembly and a method for manufacturing the same.[0003]2. Description of the Related Art[0004]In recent years, performance of electronic devices in the electronics field has improved significantly and contributed to increased information processing speeds, miniaturization of apparatuses, and expansion in functionality of information processing apparatuses, e.g., large-scale computers, mobile communication terminals, and personal computers.[0005]A multi-chip module (MCM) in which a plurality of semiconductor devices, e.g., very large scale integrations (VLSIs) and ultra large scale integrations (ULSIs), are mounted on a ceramic substrate has been used for su...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/03H05K3/00
CPCH01L21/4857Y10T29/49126H01L23/15H01L23/49822H01L24/16H01L2224/13099H01L2924/01002H01L2924/01004H01L2924/01013H01L2924/01027H01L2924/01029H01L2924/01033H01L2924/0104H01L2924/01046H01L2924/01056H01L2924/01074H01L2924/01079H01L2924/01082H01L2924/09701H01L2924/14H01L2924/19041H01L2924/19042H01L2924/19043H01L2924/19105H01L2924/30107H05K1/0306H05K3/305H05K3/4626H05K3/4629H05K2201/0116H05K2201/10378H05K2201/10674H05K2201/10977H05K2203/1147H01L2224/16225H01L2224/73204H01L2924/01005H01L2924/01006H01L2924/01047H01L2924/014H05K1/181H01L2224/16235Y10T29/49146Y10T29/4913H01L23/13H01L2924/15787H01L2924/12042Y02P70/50H01L2924/00
Inventor NOMIYA, MASATOSAKAI, NORIONISHIDE, MITSUYOSHI
Owner MURATA MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com