Heat sink for an electrical device and method of manufacturing the same
a technology of electrical devices and heat sinks, which is applied in the direction of lighting and heating apparatus, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of increasing costs, increasing size, and reducing performance, and achieves high performance, easy assembly, and dissipation of excess hea
Inactive Publication Date: 2009-03-12
PHOENIXTEC POWER
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Benefits of technology
[0017]The primary objective of the present invention is to provide a heat sink used in an electrical device, which is assembled easily and has a high performance to dissipate the excess heat.
[0018]To achieve the objective, the heat sink for an electrical device in accordance with the present invention has a frame and at least one fin. The frame has an inner chamber. The fin is mounted in the inner chamber of the frame to separate the inn
Problems solved by technology
Apparently, the methods have the disadvantage such as increasing the cost, enlarging the size, and decreasing the performance.
Because of the limitation of design, usually only the electrical elements on the same frame are acti
Method used
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A heat sink for an electrical device has a frame and at least one fin. The frame has an inner chamber. The fin is mounted in the inner chamber of the frame to separate the inner chamber of the frame into at least two channels. Therefore, heat generated from any electrical element connected to or mounted on the heat sink will transfer evenly to the heat sink. The heat sink not only dissipates heat evenly, but also provides multiple channels to dissipate heat by convection. Because the heat sink only has one frame, assembly of an electrical device is easy and quick.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of Invention[0002]The present invention relates to a heat sink used in electrical devices, and more particularly to a heat sink used in an un-interruptible power supply (UPS), which is assembled easily and has excellent efficiency of heat dissipation.[0003]2. Description of the Related Art[0004]Electrical devices, such as an un-interruptible power supply (UPS), require excess heat to be removed leading to the development of heat sinks.[0005]Conventional methods of dealing with the excess heat are such as selecting low heat generating elements, enlarging the heat sink or increasing the fans to remove the heat out of the device. Apparently, the methods have the disadvantage such as increasing the cost, enlarging the size, and decreasing the performance. Each of said methods goes against the object of the high power density and miniaturization, so the best method is improving the efficiency of the heat dissipation.[0006]The heat sink of the ele...
Claims
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CPCH01L23/367H01L23/467H01L2924/0002H01L2924/00
Inventor LAI, YU-JENSU, SONG-KAI
Owner PHOENIXTEC POWER