Semiconductor range-finding element and solid-state imaging device

Abstract

To transfer signal charges generated by a semiconductor photoelectric conversion element in opposite directions, the center line of a first transfer gate electrode and that of a second transfer gate electrodes are arranged on the same straight line, and a U-shaped first exhausting gate electrode and a second exhausting gate electrode are arranged to oppose to each other. The first exhausting gate electrode exhausts background charges generated by a background light in the charge generation region, and the second exhausting gate electrode exhausts background charges generated by the background light in the charge generation region. The background charges exhausted by the first exhausting gate electrode are received by a first exhausting drain region and the background charges exhausted by the second exhausting gate electrode are received by a first exhausting drain region.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a semiconductor range-finding element and a solid-state imaging device in which semiconductor range-finding elements are arrayed one-dimensionally or two-dimensionally.DESCRIPTION OF THE RELATED ART[0002]As reported by R. Miyagawa et al., “CCD-Based Range-Finding Sensor”, IEEE Transaction on Electron Devices, October 1997, Vol. 44, No. 10, pp. 1648-1652, with a pioneering report of one-dimensional CCD range-finding sensor, which has been firstly reported in 1997, the development of time-of-flight (TOF) type range-finding sensors using time-of-flight of light and obtaining range images are advancing in many fields.[0003]However, the resolution of the currently available TOF range-finding sensor remains within about 20,000 pixels. Also, in the case of using the CCD, as the number of the pixels is increased, it becomes difficult to drive the pixels. In the hybrid method of combining CMOS manufacturing process and CCD manufact...

AI Technical Summary

Benefits of technology

[0006]It is an object of the present invention to provide a TOF type semiconductor range-finding element, by effectively reducing the influence of a background light, which has a high range measurement precision (distance resolution), a wide maximum range measurement coverage and a wide dynamic range, and a TOF type solid-state imaging device in which a plurality of TOF type semiconductor range-finding elements are arranged in one-dimensionally or two-dimensionally.

Problems solved by technology

However, the earlier TOF range-finding sensors could not effectively reduce the influence of background light.

Thus, when there are bias charges caused by the background light, the shot noise causes the drop in a range measurement precision.

When the dynamic range is assumed to be represented by the maximum value for the signal and the noise level, the increase in the noise leads to the decrease in the dynamic range.

However, the use of various insulating films other than the silicon oxide film (SiO2 film) is not inhibited.

Ta2O5 and Bi2O3 are poor in thermal stability on the interface with poly-crystal silicon.

However, the lack of the thermal stability on the interface with the poly-crystal silicon and the hysteresis characteristic of the ferroelectric material are required to be considered.

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