Heat-radiating base plate and heat sink using the same

a technology of heat-radiating base plate and heat-sink, which is applied in the direction of lighting and heating apparatus, tubular elements, semiconductor devices, etc., can solve the problems of base b>11/b> being usually overweight, and the error in size, so as to achieve a less copper material and enhanced heat-dissipation effect

Inactive Publication Date: 2010-05-27
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011]And, the heat sink according to the present invention includes a radiating fin assembly mounted to a top of the first face of the heat-radiating base plate of the present invention. The radiating fin assembly includes a plurality of stacked and spaced radiating fins. With the heat pipe unit set in the slotted pattern, the first face of the aluminum-made upper base plate attached to the radiating fin assembly, and the second face of the upper base plate attached to the copper-made lower base plate, the heat sin

Problems solved by technology

In the prior art, when forming the S-shaped channel 111 and the U-shaped channel 112 on the base 11, it is uneasy to control the depth of the S-shaped channel 111 and the U-shaped channel 112

Method used

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  • Heat-radiating base plate and heat sink using the same
  • Heat-radiating base plate and heat sink using the same
  • Heat-radiating base plate and heat sink using the same

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Embodiment Construction

[0019]Please refer to FIGS. 2, 3 and 4. A heat-radiating base plate 2 according to a preferred embodiment of the present invention includes an upper base plate 21, a lower base plate 22, and a heat pipe unit 23. The upper base plate 21 has a first face 211, a second face 212 opposite to the first face 211, and a slotted pattern 213. The slotted pattern 213 is extended through the upper base plate 21 in a thickness direction to communicate the first face 211 with the second face 212. The upper base plate 21 can be made of an aluminum material. The heat pipe unit 23 is set in the slotted pattern 213. The heat pipe unit 23 includes at least one heat pipe, which is set in the slotted pattern 213. The heat pipe unit 23 has a thickness equal to a depth of the slotted pattern 213, and has a flat first heat-conducting face 231 and a flat second heat-conducting face 232 corresponding to and flush with the first face 211 and the second face 212 of the upper base plate 21, respectively. The se...

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Abstract

A heat-radiating base plate includes an aluminum-made upper base plate, a copper-made lower base plate, and a heat pipe unit. The upper base plate has a first face, an opposite second face, and a slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face. The heat pipe unit is set in the slotted pattern, and has a thickness equal to a depth of the slotted pattern. The heat pipe unit has a first and a second heat-conducting flat face flush with the first and the second face of the upper base plate, respectively. The second face and the second heat-conducting face are attached to the lower base plate, which has another flat face in contact with a heat-producing unit. A radiating fin assembly can be mounted to a top of the heat-radiating base plate to provide a heat sink.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a heat-radiating base plate, and more particularly to a weight-reduced heat-radiating base plate including an aluminum-made upper base plate formed of a slotted pattern for a heat pipe unit to set therein, and a copper-made lower base plate corresponding to and attached to the upper base plate without losing its flatness. The present invention also relates to a heat sink including a radiating fin assembly mounted to a top of the heat-radiating base plate.BACKGROUND OF THE INVENTION[0002]With the rapidly developed information, communication, and photoelectric industries, various highly advanced, lightweight and compact electronic products have been introduced into the market. Due to the demands for high operating speed and miniaturized volume, the electronic elements in the various electronic products produce more heat during the operation thereof to thereby have constantly increased heat density. Therefore, heat dissipatio...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCF28D15/0233F28F1/22F28F1/32H01L23/427H01L2924/0002H01L23/467H01L2924/00F28D15/0275
Inventor CHEN, LI-LING
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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