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Lithographic Apparatus and Device Manufacturing Method

a technology of lithographic apparatus and manufacturing method, which is applied in the direction of photomechanical apparatus, optical instruments, instruments, etc., to achieve the effect of minimizing frame vibration, minimizing frame vibration, and minimizing frame vibration

Inactive Publication Date: 2011-07-14
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a lithographic apparatus and a method for manufacturing devices using it. The apparatus includes a projection system, a frame, a mount, and a piezo-electric actuator. The mount holds the projection system on the frame using the piezo-electric actuator, which applies force to the projection system. A sensor measures the position or time derivative of the frame, and the actuator is controlled based on the measured position or time derivative. This helps to reduce alignment errors and improve the accuracy of the patterned beam. The method involves holding the patterning device and substrate, projecting the patterned beam onto the substrate, measuring the position or time derivative of the frame, and controlling the actuator based on the measured position or time derivative. The apparatus and method can also minimize vibrations and improve the stability of the frame.

Problems solved by technology

However, if the frame supporting the projection system and / or the substrate table and / or the support for the patterning device move or vibrate while the projection system remains stationary alignment errors could result.

Method used

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  • Lithographic Apparatus and Device Manufacturing Method

Examples

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Embodiment Construction

[0020]FIG. 1 schematically depicts a lithographic apparatus according to one embodiment of the invention. The apparatus includes an illumination system (illuminator) IL configured to condition a radiation beam B (e.g. UV radiation), a support structure (e.g. a mask table) MT constructed to support a patterning device (e.g. a mask) MA and connected to a first positioner PM configured to accurately position the patterning device in accordance with certain parameters, a substrate table (e.g. a wafer table) WT constructed to hold a substrate (e.g. a resist-coated wafer) W and connected to a second positioner PW configured to accurately position the substrate in accordance with certain parameters, and a projection system (e.g. a refractive projection lens system) PL configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g. including one or more dies) of the substrate W. The projection system is mounted to the reference frame RF...

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PUM

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Abstract

Data from the piezo-electric sensors in the mounts for the projection system can be used in the control loops for other parts of the lithographic apparatus, for example the mask table, the substrate table or the air mounts for the frame bearing the projection system. Information from, for example, a geophone, which is used to measure the absolute velocity of the frame bearing the projection system, can be used in the control loop for the piezo-electric actuator in the mount for the projection system.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is a Divisional of pending U.S. patent application Ser. No. 11 / 430,181; filed May 9, 2006, which is incorporated by reference herein in its entirety.BACKGROUND[0002]1. Field of the Invention[0003]The present invention relates to a lithographic apparatus and a method for manufacturing a device.[0004]2. Background Art[0005]A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that instance, a patterning device, which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g. including part of, one, or several dies) on a substrate (e.g. a silicon wafer). Transfer of the pattern is typically via imaging o...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/66G03B27/58
CPCG03F7/70833H01L21/0274G03F7/709
Inventor BUTLER, HANSAUER, FRANK
Owner ASML NETHERLANDS BV
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