Heat dissipation device which is pre-built with an air vent structure

Abstract

A heat dissipation device which is pre-built with an air vent structure uses primarily a plurality of cooling fins, which are formed into different lengths, to assemble into the heat dissipation devices of different shapes, for shunning away from other elements inside a computer host. In addition, diversion baffles of a different angle can be arranged and assembled, so as to form air ducts following an angle of wind direction, allowing an air flow to be smoothly guided in by a fan, and to quickly flow into a heat transmission zone in a gap between the cooling fins, such that a heat source can be dissipated more quickly.

Description

BACKGROUND OF THE INVENTION[0001]a) Field of the Invention[0002]The present invention relates to a heat dissipation device which is pre-built with an air vent structure, and more particularly to a heat dissipation device which is formed with all kinds of shapes by assembling cooling fins that are shaped in advance with different lengths, so as to avoid other structures and to form diversion baffles as air ducts for guiding an cold air flow.[0003]b) Description of the Prior Art[0004]To solve an over-heat problem of elements inside a computer host, usually a heat dissipation device is installed on an electronic heating element, such that heat generated from the electronic element can be dissipated by the heat dissipation device. However, for the conventional heat dissipation device, a base plate of a radiator is installed with cooling fins, and the base plate is tightly pressed on the electronic heating element, to dissipate heat energy from high temperature created when the electroni...

AI Technical Summary

Benefits of technology

[0009]Still another object of the present invention is to form a variation of shapes integrally, allowing the heat dissipation device to have a beautiful appearance.

Problems solved by technology

However, for the conventional heat dissipation device, a base plate of a radiator is installed with cooling fins, and the base plate is tightly pressed on the electronic heating element, to dissipate heat energy from high temperature created when the electronic element is operating, through the cooling fins.

Although this kind of heat dissipation device has a low cost, its heat conduction rate is slow, and hence is only suitable for a computer with a lower operation speed.

As the heat dissipation effect is limited for the electronic heating element requiring to operate with a fast speed or for a long time, the conventional heat dissipation device is not perfect at all.

Nevertheless, as end surfaces of the cold air inlets and the hot air outlets are all vertical to a plane, a wind-break wall will be formed to block the air flow from the fan when the cold air blows in; therefore, it is easy to result in a stagnant layer, such that a heat source will be accumulated between the cooling fins and the fan, thereby wasting power of the fan, and allowing the heat dissipation effect to only work for a normal application.

However, in order to increase wind pressure, rotation of the fan will result in louder noise, and thereby troubling people.

However, as all kinds of elements are having different specifications, they are often unable to be emplaced or are often in conflict with the radiator in assembling, due to the incompatibility with the specification of radiator.

Therefore, other suitable heat dissipation device should be searched for, which usually forms the biggest trouble and an issue to be overcome mostly, upon assembling the radiator.

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