Heat dissipation device which is pre-built with an air vent structure

Abstract

A heat dissipation device which is pre-built with an air vent structure uses primarily a plurality of cooling fins, which are formed into different lengths, to assemble into the heat dissipation devices of different shapes, for shunning away from other elements inside a computer host. In addition, diversion baffles of a different angle can be arranged and assembled, so as to form air ducts following an angle of wind direction, allowing an air flow to be smoothly guided in by a fan, and to quickly flow into a heat transmission zone in a gap between the cooling fins, such that a heat source can be dissipated more quickly.

Description

BACKGROUND OF THE INVENTION[0001]a) Field of the Invention[0002]The present invention relates to a heat dissipation device which is pre-built with an air vent structure, and more particularly to a heat dissipation device which is formed with all kinds of shapes by assembling cooling fins that are shaped in advance with different lengths, so as to avoid other structures and to form diversion baffles as air ducts for guiding an cold air flow.[0003]b) Description of the Prior Art[0004]To solve an over-heat problem of elements inside a computer host, usually a heat dissipation device is installed on an electronic heating element, such that heat generated from the electronic element can be dissipated by the heat dissipation device. However, for the conventional heat dissipation device, a base plate of a radiator is installed with cooling fins, and the base plate is tightly pressed on the electronic heating element, to dissipate heat energy from high temperature created when the electroni...

AI Technical Summary

Benefits of technology

[0005]Accordingly, the present invention is to provide a heat dissipation device which is pre-built with an air vent structure, having a good efficiency of heat dissipation in a limited space inside a computer host. Specifically, in the present invention, a cooling fin set is formed by mutually connecting cooling fins into an integral body, with a punching technology. The cooling fins are pre-built with different lengths, such that all kinds of heat dissipation devices of different shapes can be arranged after assembling, so as to shun away from other elements inside the computer host in emplacement. In addition, due to the pre-built assembly, a plurality of diversion baffles can be formed. A certain angle can appear on the diversion baffles, following a direction of wind, to form a proper bus duct, for guiding a direction of air flow when a fan is operating, allowing the air flow to quickly flow toward a heat transmission zone in each gap between the cooling fins, thereby more quickly dissipating heat received by the cooling fins. As the cooling fins of different lengths can be pre-built for the present invention, a combination of different shapes can be formed, and other elements can be shunned away in accordance with a location and an angle of the fan inside the computer host; therefore, all kinds of choices can be available to fit with down-stream vendors and to facilitate the assembly by a user, thereby being extremely suitable for and facilitating the assembly of all kinds of heat dissipation devices. In particular, when the air flow is guided in by the fan, a vortex-shape wind-break wall created by the air flow can be destroyed due to a blocking of the diversion baffles, so as to prevent from a reflux phenomenon resulted by reflection and collision of the air flow. Moreover, a flow field becomes smaller by an included angle formed by the air flow, which increases the wind pressure formed when the air flow blows toward the heat transmission zones, and relatively increases the air flow rate, allowing the air flow which is guided in by the fan to be guided by the diversion baffles to flow quickly and continuously, without causing a stagnant condition. Therefore, it will effectively increase a convection efficiency of the air which passes through the cooling fins, such that a function of the fan can be developed sufficiently, noise of the fan can be reduced, and the best heat dissipation function can be achieved, thereby truly solving an over-heat problem for the computer elements. In addition, as the shapes of cooling fins can be pre-built, the heat dissipation device can be formed integrally with a variation of shapes, thereby allowing the heat dissipation device to be provided with a beautiful appearance.

[0007]Another object of the present invention is to solve a limitation to the heat dissipation effect for the conventional computer heat dissipation structure, such that by using the cooling fins of different lengths, the diversion baffles are assembled to form air ducts with a certain angle, which allows the cold air to be quickly guided into the cooling fins following the air ducts, to dissipate the heat and reduce temperature efficiently, thereby achieving the best heat dissipation effect.

[0009]Still another object of the present invention is to form a variation of shapes integrally, allowing the heat dissipation device to have a beautiful appearance.

Problems solved by technology

However, for the conventional heat dissipation device, a base plate of a radiator is installed with cooling fins, and the base plate is tightly pressed on the electronic heating element, to dissipate heat energy from high temperature created when the electronic element is operating, through the cooling fins.

Although this kind of heat dissipation device has a low cost, its heat conduction rate is slow, and hence is only suitable for a computer with a lower operation speed.

As the heat dissipation effect is limited for the electronic heating element requiring to operate with a fast speed or for a long time, the conventional heat dissipation device is not perfect at all.

Nevertheless, as end surfaces of the cold air inlets and the hot air outlets are all vertical to a plane, a wind-break wall will be formed to block the air flow from the fan when the cold air blows in; therefore, it is easy to result in a stagnant layer, such that a heat source will be accumulated between the cooling fins and the fan, thereby wasting power of the fan, and allowing the heat dissipation effect to only work for a normal application.

However, in order to increase wind pressure, rotation of the fan will result in louder noise, and thereby troubling people.

However, as all kinds of elements are having different specifications, they are often unable to be emplaced or are often in conflict with the radiator in assembling, due to the incompatibility with the specification of radiator.

Therefore, other suitable heat dissipation device should be searched for, which usually forms the biggest trouble and an issue to be overcome mostly, upon assembling the radiator.

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