Dual Arm Robot

a robot and arm technology, applied in the field of dual arm robots, can solve the problem that the robot cannot be used in a vacuum transport module built per semi-mesc standards

Inactive Publication Date: 2012-02-23
BOOKS AUTOMATION US LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This robot, however, cannot be used in a vacuum transport module built per SEMI MESC standards, because the isolation valves of such a vacuum transport module are too narrow to allow passage of the arm that includes the C-type bracket per the SEMI specification that defines wafer transport planes within cassette and process modules.

Method used

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Examples

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Embodiment Construction

[0125]The present invention relates to a dual arm, cylindrical coordinate robot assembly, and more particularly to the manipulator, the system of links and joints that cooperate to position a pair of end effectors, for such a robot assembly.

[0126]For purposes of describing the present invention, the manipulator can be described as a mechanical assembly and broken down into major linkages, minor linkages (wrist components), and the end effector. The major linkages are the set of joint-link pairs that position the manipulator in space. Usually, the major linkages are the first three sets of joint-link pairs. The first joint-link pair includes a prismatic joint (e.g., a linear bearing) and a link (e.g., a carriage) that allows for vertical displacement of the tool. The second joint-link pair includes a revolute joint (e.g., a radial ball bearing) and a link (e.g., an inner link). The third joint-link pair includes a revolute joint (e.g., a radial ball bearing) and a link (e.g., an oute...

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Abstract

A robot assembly for transporting a substrate is presented. The robot assembly having a first arm and a second arm supported by a column, the first arm further having a first limb, the first limb having a first set of revolute joint / line pairs configured to provide translation and rotation of the distalmost link of the first limb in the horizontal plane. The assembly further having a second arm further having a second limb, the second limb comprising a second set of revolute joint / link pairs configured to provide translation and rotation of a distalmost link of the second limb in the horizontal plane. The first limb and second limb further having proximal revolute joints having a common vertical axis of rotation and a proximal inner joint housed in a common housing. The assembly further having an actuator assembly coupled to the first set of revolute joint / link pairs and to the second set of revolute joint / link pairs to effect rotation and translation of the distalmost links of the first limb and the second limb, each of the first limb and the second limb defining, in conjunction with the actuator assembly, at least three degrees of freedom per limb, whereby the distal most links of the first limb and the second limb are independently horizontally translatable for extension and retraction.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This is a divisional application of application Ser. No. 10 / 434,582, filed May 9, 2003 which claims priority under 35 U.S.C. §119(e) to prior U.S. provisional applications Ser. Nos. 60 / 378,983, 60 / 379,095 and 60 / 379,063; all filed May 9, 2002, the disclosures of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]Robots are used to perform many tasks in the semiconductor industry, such as the automated handling of substrate media or other objects. In the semiconductor industry, typical media and other objects include individual silicon wafers or wafer carriers, flat panel displays, and hard disk media. Robots may be used for handling media in, for example, wafer processing cluster tools, wafer inspection equipment, metrology equipment, and equipment for hard disk thin film deposition, and in transferring media between production equipment and automated material handling systems in semiconductor factories. Robots ma...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B25J18/04B25J9/04H01L21/677
CPCB25J9/042H01L21/67739Y10S901/17Y10T74/20317B25J9/126B25J15/0246Y10S901/23Y10T74/20323Y10T74/20341B25J9/043B25J9/044H01L21/67742
Inventor KREMERMAN, IZYA
Owner BOOKS AUTOMATION US LLC
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