Polishing method, manufacturing method of piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled timepiece

Abstract

Provided is a polishing method which can enhance thickness accuracy of a wafer at the time of polishing the wafer. In a polishing method of a crystal wafer (tuning fork substrate) which is held on a carrier between an upper platen and a lower platen, an AT cut wafer for thickness measurement is arranged on the carrier, the AT cut wafer is polished together with the crystal wafer (tuning fork substrate), resonance frequency of the AT cut wafer is detected, and a thickness of the crystal wafer (tuning fork substrate) is controlled based on a detection result.

Description

RELATED APPLICATIONS[0001]This application claims priority under 35 U.S.C. §119 to Japanese Patent Application No. 2011-070538 filed on Mar. 28, 2011, the entire content of which is hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a polishing method, a manufacturing method of a piezoelectric vibrating piece, a piezoelectric vibrator having a piezoelectric vibrating piece manufactured by the manufacturing method of a piezoelectric vibrating piece, an oscillator having the piezoelectric vibrator, an electronic apparatus, and a radio-controlled timepiece.[0004]2. Description of the Related Art[0005]Recently, a package product having the following constitution has been popularly used. The package product includes a base substrate and a lid substrate which are bonded to each other by anodic bonding in a laminated state and form a cavity therebetween, and an operating piece which is mounted on a portion of th...

AI Technical Summary

Benefits of technology

[0027]Further, the irregularities of thickness among the plurality of tuning fork forming wafers held for each carrier can be decreased, and also irregularities of thickness of the tuning fork forming wafers among a plurality of carriers can be decreased.

[0028]According to the polishing method of the present invention described in (3), the rotational balance of the carrier in rotation and revolution can be enhanced for each carrier and hence, parallelism of the tuning fork forming wafer can be enhanced.

[0029]According to the polishing method of the present invention described in (4), the thickness accuracy of the tuning fork forming wafer can be enhanced.

[0030]According to the polishing method of the present invention described in (5), the rotational balance of the AT cut wafer can be enhanced and hence, the thickness accuracy and parallelism of the tuning fork forming wafer can be enhanced.

[0031]According to the manufacturing method of a piezoelectric vibrating piece of the present invention described in (6), thickness accuracy and parallelism of the tuning fork forming wafer can be enhanced and hence, the operational reliability of the piezoelectric vibrating piece can be enhanced.

[0032]The piezoelectric vibrator, the oscillator, the electronic apparatus and the radio-controlled timepiece of the present invention can enhance operational reliability.

Problems solved by technology

The above-mentioned method pertaining to the related art gives rise to a drawback that the method is not applicable to polishing of a tuning fork forming wafer which vibrates in a bending mode.

However, as in the case of this measuring device, when a measuring terminal is brought into contact with a suitable part of the polishing device, the measuring position becomes the same point and hence, wear occurs thus giving rise to a drawback that thickness accuracy of a tuning fork forming wafer cannot be enhanced.

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