Apparatus and method for UV treatment, chemical treatment, and deposition

Abstract

Embodiments of the present invention provide apparatus and methods for performing UV treatment and chemical treatment and / or deposition in the same chamber. One embodiment of the present invention provides a processing chamber including a UV transparent gas distribution showerhead disposed above a substrate support located in an inner volume of the processing chamber, a UV transparent window disposed above the UV transparent gas distribution showerhead, and a UV unit disposed outside the inner volume. The UV unit is configured to direct UV lights towards the substrate support through the UV transparent window and the UV transparent gas distribution showerhead.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims benefit of U.S. Provisional Patent Application Ser. No. 61 / 473,577 filed Apr. 8, 2011, which is herein incorporated by reference.BACKGROUND[0002]1. Field[0003]Embodiment of the present invention generally relates to a method and apparatus for fabricating devices on a semiconductor substrate. More particularly, embodiments of the present invention provide apparatus and methods for performing UV treatment and chemical treatment and / or deposition in the same chamber.[0004]2. Description of the Related Art[0005]As the size of the electronic devices is reduced, new materials with a low dielectric constant (k), such as materials with dielectric value as low as 2.2, are used in forming the electronic devices.[0006]Plasma-deposited porous low k films are one class of materials that is able to satisfy such a requirement. The presence of pores and carbon, which contributes to low dielectric value, creates significant process...

AI Technical Summary

Problems solved by technology

The presence of pores and carbon, which contributes to low dielectric value, creates significant process integration challenges since the pores are susceptible to etching, ashing, and plasma damages.

Traditional k-restoration is performed in separate chambers because the chemical surface treatment uses a showerhead to supply a processing gas including halogen or ozone while the UV chamber uses a quartz window which usually is not compatible with halogen and ozone.

However, the two chamber k-restoration process increases cost of ownership by requiring two chambers and additional time for substrate transfer.

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