Substrate processing apparatus, substrate processing method, and nozzle
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[0071]FIG. 1 is a schematic view of a general arrangement of a substrate processing apparatus 1 according to a first preferred embodiment of the present invention. FIG. 2 is a plan view of an injection nozzle 5 and an arrangement related thereto according to the first preferred embodiment of the present invention.
[0072]The substrate processing apparatus 1 is a one-by-one type substrate processing apparatus that processes a semiconductor wafer or other circular substrate W one at a time. As shown in FIG. 1, the substrate processing apparatus 1 includes a spin chuck 2 (substrate holding unit, substrate rotating unit) that horizontally holds and rotates the substrate W, a tubular cup 3 surrounding the spin chuck 2, a rinse liquid nozzle 4 supplying a rinse liquid to the substrate W, an injection nozzle 5 (injection unit, liquid film forming unit) making droplets of a processing liquid collide with the substrate W, and a controller 6 controlling operations of the spin chuck 2 and other ...
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