Substrate processing apparatus, substrate processing method, and nozzle

Inactive Publication Date: 2013-02-28
SCREEN HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0010]A preferred embodiment of the present invention provides a substrate processing apparatus and a substrate processing method that enable reduction of v

Problems solved by technology

Further, the cover rinse liquid flowing to a collision position at a downstream side with respect to a direction of flow of the cover rinse liquid along the substrate is impeded in its progress by droplets injected onto a collision position at an upstream side, and thus a supply flow rate of the cover rinse liquid differs between the upstream side collision position and the downstream side collision position, thereby further increasing the variation of liquid film thickness.
Thus, with the substrate processing apparatus described in Japanese Unexamined Patent Application Publication No. 2011-29315, it is difficult to control the liquid film thicknesses at the respective collision positions to be of a fixed magnitude.
When the liquid film covering the collision positions

Method used

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  • Substrate processing apparatus, substrate processing method, and nozzle
  • Substrate processing apparatus, substrate processing method, and nozzle
  • Substrate processing apparatus, substrate processing method, and nozzle

Examples

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Example

[0071]FIG. 1 is a schematic view of a general arrangement of a substrate processing apparatus 1 according to a first preferred embodiment of the present invention. FIG. 2 is a plan view of an injection nozzle 5 and an arrangement related thereto according to the first preferred embodiment of the present invention.

[0072]The substrate processing apparatus 1 is a one-by-one type substrate processing apparatus that processes a semiconductor wafer or other circular substrate W one at a time. As shown in FIG. 1, the substrate processing apparatus 1 includes a spin chuck 2 (substrate holding unit, substrate rotating unit) that horizontally holds and rotates the substrate W, a tubular cup 3 surrounding the spin chuck 2, a rinse liquid nozzle 4 supplying a rinse liquid to the substrate W, an injection nozzle 5 (injection unit, liquid film forming unit) making droplets of a processing liquid collide with the substrate W, and a controller 6 controlling operations of the spin chuck 2 and other ...

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Abstract

A substrate processing apparatus includes a substrate holding unit that holds a substrate, an injection unit that injects droplets of a processing liquid from a plurality of injection ports respectively toward a plurality of collision positions within a principal surface of the substrate held by the substrate holding unit, and a liquid film forming unit. The liquid film forming unit discharges a protective liquid from a plurality of discharge ports respectively toward a plurality of liquid contact positions within the principal surface of the substrate held by the substrate holding unit to form a plurality of liquid films of the protective liquid that respectively cover different collision positions.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate, and a nozzle that makes droplets collide with a substrate covered by a liquid film. Examples of substrates to be processed include semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for FEDs (Field Emission Displays), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.[0003]2. Description of Related Art[0004]In a manufacturing process for a semiconductor device or a liquid crystal display, etc., a substrate processing apparatus is used to process substrates, such as semiconductor wafers, glass substrates for liquid crystal displays. A substrate processing apparatus described in Japanese Unexamined Patent Application P...

Claims

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Application Information

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IPC IPC(8): B05C5/00B05D1/02B05B1/00B05C11/00
CPCB05B13/0228B05B17/0607B05C11/08H01L21/6715H01L21/67051H01L21/02H01L21/302B05B1/02B05B3/02
Inventor MAEGAWA, TADASHIARAKI, HIROYUKI
Owner SCREEN HLDG CO LTD
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