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Method for producing laminated electronic component, and laminated electronic component

a technology of electronic components and laminates, applied in the direction of fixed capacitor details, stacked capacitors, transportation and packaging, etc., can solve the problems of difficult individual positioning of laminates one, inconvenient manufacturing, and insufficient mass productivity, so as to achieve the effect of efficient manufacturing of laminated electronic parts

Active Publication Date: 2013-10-10
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention aims to provide a new part structure for a laminated electronic part that exhibits satisfactory electric characteristics even in reduced size. The invention eliminates the need for individual handling of laminates while bonding them, resulting in high operability and good productivity. The part structure includes multiple laminates laminated in different directions to prevent mutual interference between circuit elements and achieve satisfactory electrical characteristics. The invention also provides a conductor connection structure that allows various circuit elements included in different laminates to be directly connected without intervention of connection conductors, thereby preventing deterioration in electric characteristics. The method of manufacturing a laminated electronic part according to the invention is efficient and allows for the efficient manufacture of a part with multiple ceramic laminates.

Problems solved by technology

Therefore, the structures described in these documents require more efforts in manufacturing and is inferior in mass productivity.
Moreover, as a smaller target (chip size) causes positioning errors to become relatively larger and highly accurate positioning to be exceptionally more difficult, it is not easy to individually perform the positioning of laminates one by one and adhere the laminates.
Thus, the structures described in the aforementioned documents cannot be said to be a pragmatic structure suitable for mass production.
Also, the sintering of individual laminates not only involves complicated treatments but also causes a lower stability in shape, as compared with the laminates which are placed in groups.
Particularly, small-sized individual laminates can suffer from deformations when they are sintered, and such deformations can cause misalignments between internal electrodes of the laminates when they are bonded to each other.
As such, with the conventional structures of the parts, it is difficult to manufacture a laminated electronic part including a plurality of ceramic laminates which are laminated in different directions satisfactorily with respect to the yield rate and productivity.

Method used

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  • Method for producing laminated electronic component, and laminated electronic component
  • Method for producing laminated electronic component, and laminated electronic component
  • Method for producing laminated electronic component, and laminated electronic component

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Embodiment Construction

[0064]Referring to FIGS. 1 through 19, a method of manufacturing a laminated electronic part will be described in order in accordance with one embodiment of the present invention. In this regard, FIG. 1 and subsequent figures show three-dimensional coordinates consisting of an x-axis, a y-axis, and a z-axis, which are orthogonal to one another, as required. These figures and the embodiment will be described with definitions that, among these coordinate axes, the x-direction indicates a width direction (horizontal direction / left-to-right direction), the y-axis indicates a depth direction (horizontal direction / back-to-forth direction), and the z-direction indicates a height direction (vertical direction / up-down direction).

[0065]Also, as shown in FIG. 19, the manufacturing method of this embodiment is directed to manufacturing of a laminated electronic part 41 (hereinafter sometimes referred to as the “chip”) which comprises first laminates 51, 52 that have their respective wiring laye...

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Abstract

A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

Description

TECHNICAL FIELD[0001]The present invention relates to a method of manufacturing a laminated electronic part and such a laminated electronic part, and more particularly, to an electronic part which includes a plurality of ceramic laminates that differ in the direction in which internal conductive layers are laminated.BACKGROUND ART[0002]Laminated electronic parts have been provided for implementing a variety of circuit functions. The laminated electronic part comprises circuit elements such as circuit components, connection conductors, and the like disposed on a plurality of wiring layers of a laminate in a distributed manner.[0003]Meanwhile, as electronic devices are increasingly reduced in size and profile and provided with more and more functions, electronic parts which comprise the devices are highly required to be reduced in size and height (thickness), as well as to be increased in functionality and integration. For example, a filter for a laminated ceramic electronic part is o...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B38/00B32B18/00B32B5/00
CPCH01G4/005Y10T428/24058H01G4/30H01G4/40H03H7/0115H03H2001/0085B32B5/00B32B18/00B32B38/0004B32B38/0036C04B2237/34C04B2237/343C04B2237/346C04B2237/68C04B2237/704C04B2237/76C04B2237/80Y10T156/1089H01G4/12
Inventor KIMURA, KAZUNARITABATA, MISAKITOMAKI, SHIGEMITSUNAKAMURA, AKIRAABE, ISAOSAITO, NORIYUKI
Owner TDK CORPARATION