Trimethyl borate in epoxy resins

a technology of trimethyl borate and epoxy resin, which is applied in the direction of plastic/resin/waxes insulators, adhesive types, coatings, etc., can solve the problems of formulation curing, formulation may not have significant long-term storage stability, and may not be useful to the manufacturer of prepreg or lamina

Inactive Publication Date: 2014-02-13
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem is that if the epoxy resin curing agent and catalyst are preformulated, the formulation may not have significant long term stora

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0083]The boric acid example was prepared from DER™ 593 using appropriate mix ratios of DER™ 592A80, Dowanol PM, boric acid in methanol (BAM), and methanol (6167 g). The mixture was then added to a dicyanamide solution (10 wt % in 50 / 50 Dowanol™ PM and dimethyl formamide, 1480 g) and mixed on a shaker or with a mixing blade for 15 minutes. To this solution, 2 methyl imidazole (20 wt % solution in Dowanol PM, 86.14 g) was added and the allowed to mix for 1 hour at ambient temperature. The varnish can be used as is for further testing. This varnish prepared from this example was tested for a variety of laminate qualities and is shown as the control shown in Table 1.

example 2

[0084]The trimethyl borate example was prepared from D.E.R.™ 593 using appropriate mix ratios of DER 592A80, Dowanol PM, and neat trimethyl borate (4612 g). The mixture was then added to a dicyanamide solution (10 wt % in 50 / 50 Dowanol PM and dimethyl formamide, 1107 g) and mixed on a shaker or with a mixing blade for 15 minutes. To this solution, 2 methyl imidazole (20 wt % solution in Dowanol PM, 64.6 g) was added and the mixture was allowed to mix for 1 hour at ambient temperature. The varnish can be used as is for further testing. The varnish prepared from this example was tested for a variety of laminate qualities and is shown as the control in Table 1.

TABLE 1593 / Dicy / Boric Acid593 / Dicy / (Control)TrimethylborateLaminate Thickness1.40-1.501.42-1.50(mm)Tg (° C.)173173Td (5% wt loss, ° C.)297296% Resin4547T-260 (min)6.56.6UL-94 RatingV-0V-0Cu Peel (lb / in)10.510.3Water Uptake (%)0.420.40Solder Dip @ 550 F. (%100100Pass)Prepreg Gel Time (s)96100AppearanceGoodGood

As is evident from Ta...

example 3

[0085]Sample formulations were prepared by adding methanol and Dowanol™ PM to DER™ 592 epoxy resin. BAM and TMB were then added, respectively, to the samples whilst maintaining the same solvent levels and mix ratios. The resin mixtures were then thoroughly mixed on a shaker for 1 h at ambient conditions. Dowanol™ PM was used to solubilize the mixtures. These samples were used for contact angle and surface energy measurements.

Surface Tension and Contact Angles of BAM / TMB-Containing Samples

[0086]Surface tension and contact angle measurements were performed using a Cahn dynamic contact angle analyzer (DCA). The DCA calculates the contact angle by monitoring the change in force when one body comes into contact with another. A microscope cover glass 24 mm×30 mm×0.16 mm was accurately measured and attached to the instrument. A 60 mm diameter by 15 mm deep glass dish was filled to a depth of about 6-8 mm with sample solution. The stage was raised until the cover glass was about 3 mm above ...

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Abstract

A composition comprising a polyepoxide, a hardener, trimethyl borate, and a flame retardant is disclosed. Methods for preparing the composition and its end uses are also disclosed.

Description

REFERENCE TO RELATED APPLICATIONS[0001]This application is a non-provisional application claiming priority from the U.S. Provisional Patent Application No. 61 / 481,283, filed on May 2, 2011, entitled “TRIMETHYL BORATE IN EPOXY RESINS” the teachings of which are incorporated by reference herein, as if reproduced in full hereinbelow.FIELD OF THE INVENTION[0002]The present invention relates generally to epoxy resins, to processes for the production thereof, and to thermoset products which are made from these resins.BACKGROUND OF THE INVENTION[0003]Epoxy resins are widely used in both industrial and consumer electronics because of, among other things, their chemical resistance, mechanical strength and electrical properties. For example, epoxy resins can be used in electronics as protective films, adhesive materials and / or insulating materials, such as interlayer insulating films. To be useful for these applications, the epoxy resins need to provide ease of handling and certain necessary ...

Claims

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Application Information

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IPC IPC(8): C09D163/00
CPCC09D163/00C08K5/55H01B3/40C08K3/016C08L63/00C08K3/38C09J163/00C08J5/24C08G59/30C08G59/32
Inventor BHARADWAJ, ASHWIN R.MERCER, II, WILLIAM E.BANDA, LAMECKMULLINS, MICHAEL J.
Owner DOW GLOBAL TECH LLC
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