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Electroplating basket

Inactive Publication Date: 2014-03-06
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a special basket used for electroplating that helps reduce plating differences between parts being plated. This improves the quality of the plating process.

Problems solved by technology

However, a dry film has a fixed thickness, and therefore, as the plating thickness becomes larger, various defects including non-delamination and the like occur under the method of forming a semi additive process (SAP) circuit using a dry film.
Meanwhile, when plating deviation is generated due to product design in flip chip products, plating growth occurs on the dry film, and thus a non-delamination defect occurs in a dry film strip process, which is a subsequent process.
In addition, when the plating thickness is large, a solder resist (SR) copper appearance defect due to the lowest limit of a solder resist thickness or a bump height defect due to SR thickness deviation is generated in an SR process and a bump process.
Here, the plating ion flowing out from the plating basket does not stably arrive at a subject to be plated, which may cause the plating deviation as described above.

Method used

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  • Electroplating basket
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Embodiment Construction

[0031]The objects, features and advantages of the present invention will be more clearly understood from the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions thereof are omitted. Further, in the following description, the terms “first”, “second”, “one side”, “the other side” and the like are used to differentiate a certain component from other components, but the configuration of such components should not be construed to be limited by the terms. Further, in the description of the present invention, when it is determined that the detailed description of the related art would obscure the gist of the present invention, the description thereof will be omitted.

[0032]Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attac...

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Abstract

Disclosed herein is an electroplating basket, including: a basket member of which one surface facing a subject to be plated is formed in a mesh structure; and a blind member combined with one surface of the basket member and including a plurality of shielding plates capable of being independently opened or closed depending on region.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2012-0098828, filed on Sep. 6, 2012, entitled “Electroplating Basket”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to an electroplating basket.[0004]2. Description of the Related Art[0005]Currently, with respect to printed circuit boards of various structures, including Patent Document 1, patterned plating thickness becomes varied as the specification thereof requested by customers becomes varied. In order to secure reliability, the plating thickness tends to request a target having a larger thickness than the existing targets.[0006]However, a dry film has a fixed thickness, and therefore, as the plating thickness becomes larger, various defects including non-delamination and the like occur under the method of forming a semi additive process (SAP) ...

Claims

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Application Information

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IPC IPC(8): C25D17/12
CPCC25D17/12C25D17/008C25D17/06
Inventor KANG, DAE KYUNG
Owner SAMSUNG ELECTRO MECHANICS CO LTD