Thermal management system with variable-volume material

a technology of variable volume and management system, applied in the direction of indirect heat exchangers, heat storage plants, lighting and heating equipment, etc., can solve the problems of disruption and noise disturbance, nearly 55% of failures of electronic systems, and up-to-date heat flux in the area

Inactive Publication Date: 2014-06-12
COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

Non-uniform distribution of these heat fluxes in a printed circuit board may result in the presence of areas having a heat flux of up to five times higher than the average heat flux found in a printed circuit board (˜30 W / cm2).
A recent study by the US Air Force concluded that nearly 55% of failures of electronic systems are due to heat problems.
Management and dissipation of heat are therefore crucial problems for maintaining the temperature of each element at its nominal operating temperature, which varies depending on the field of application.
However, a pump is used which may cause disruption and noise disturbance.

Method used

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  • Thermal management system with variable-volume material
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Embodiment Construction

[0012]The aim of the present invention is to provide a simple and robust system for thermal management of the operating heat flux, which is able to guide the heat flux, for example with a view to its dissipation.

[0013]The aim stated above is attained through a thermal management system comprising means able to put two heat conductors in thermal communication, or to prevent such communication these means comprising a material the volume of which varies according to temperature changes. The variable-volume material may therefore be heated for example either by one of the conductors or by an additional heat conductor forming thermal control means.

[0014]Management of the heat transfer between the two conductors can then be accomplished automatically and very safely.

[0015]In one embodiment, the thermal management system according to the invention may then form a thermal switch made of a volume-expansion material, this switch allowing, in its closed state, heat conduction between the two ...

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Abstract

A thermal management system configured to be installed between a heat source and a heat sink, including a first heat conductor and a second heat conductor, a thermal switch configured to allow or prevent thermal connection between the first and second heat conductors, the thermal switch including at least one thermally conductive material that can connect the first and second conductors by a change in its volume, and the thermal switch including a controller configured to transfer thermal energy to the phase-change material to change a connection state. The connection is made when the heat source goes above a critical temperature, since the connection enables a heat flux to be established between the heat source and the heat sink.

Description

TECHNICAL FIELD AND PRIOR ART[0001]The present invention relates to a thermal management system for controlling the transfer of a heat flux from a heat source to a heat sink.[0002]In the electronics field, rapid changes, relating in particular to increased power densities and operating speeds, are making thermal management through dissipation a dimensioning parameter in the design of electronics systems. Thermal stress has a direct influence on performance, reliability and the cost of an electronic system.[0003]In addition to small-signal transistors and integrated circuits, electronic systems also now contain medium-power transistors in units of the CMS (Surface-Mounted Components) type, the power dissipations of which for an isolated transistor are approaching one watt. In terms of heat fluxes, a thyristor may generate a flux of the order of 100 to 200 W / cm2. Some power electronics components for military applications may generate a heat flux of the order of 300 W / cm2 and systems ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F27/00
CPCF28F27/00F28D15/00F28D20/02F28F13/00G05D23/028H01L23/4275F28F2013/008F28F2013/005H01L2924/0002H01L2924/00
Inventor DELLEA, OLIVIERCORONEL, PHILIPPEGAVILLET, JEROMEOLLIER, EMMANUELSZAMBOLICS, HELGA
Owner COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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