Thermal management system with variable-volume material

Abstract

A thermal management system configured to be installed between a heat source and a heat sink, including a first heat conductor and a second heat conductor, a thermal switch configured to allow or prevent thermal connection between the first and second heat conductors, the thermal switch including at least one thermally conductive material that can connect the first and second conductors by a change in its volume, and the thermal switch including a controller configured to transfer thermal energy to the phase-change material to change a connection state. The connection is made when the heat source goes above a critical temperature, since the connection enables a heat flux to be established between the heat source and the heat sink.

Description

TECHNICAL FIELD AND PRIOR ART[0001]The present invention relates to a thermal management system for controlling the transfer of a heat flux from a heat source to a heat sink.[0002]In the electronics field, rapid changes, relating in particular to increased power densities and operating speeds, are making thermal management through dissipation a dimensioning parameter in the design of electronics systems. Thermal stress has a direct influence on performance, reliability and the cost of an electronic system.[0003]In addition to small-signal transistors and integrated circuits, electronic systems also now contain medium-power transistors in units of the CMS (Surface-Mounted Components) type, the power dissipations of which for an isolated transistor are approaching one watt. In terms of heat fluxes, a thyristor may generate a flux of the order of 100 to 200 W / cm2. Some power electronics components for military applications may generate a heat flux of the order of 300 W / cm2 and systems ...

AI Technical Summary

Benefits of technology

The patent aims to provide a simple and strong system for managing the heat transfer between two conductors. This system can guide the heat away from the conductors, ensuring safe and efficient functioning. The patent also includes a cavity with an inclined side wall that helps the system return to its original state when the conductors are disconnected. This design makes the system more reliable and durable.

Problems solved by technology

Non-uniform distribution of these heat fluxes in a printed circuit board may result in the presence of areas having a heat flux of up to five times higher than the average heat flux found in a printed circuit board (˜30 W / cm2).

A recent study by the US Air Force concluded that nearly 55% of failures of electronic systems are due to heat problems.

Management and dissipation of heat are therefore crucial problems for maintaining the temperature of each element at its nominal operating temperature, which varies depending on the field of application.

However, a pump is used which may cause disruption and noise disturbance.

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