Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution

a technology of aqueous polyimide and precursor solution, which is applied in the direction of synthetic resin layered products, thin material processing, domestic applications, etc., can solve the problems of environmental protection, limited application, and inconvenient operation, and achieves good environmental acceptability, high transparency, and excellent properties such as flexibility and heat resistance. , the effect of high transparency

Inactive Publication Date: 2014-12-11
UBE IND LTD
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  • Abstract
  • Description
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Benefits of technology

[0059]According to the present invention, there may be provided an aqueous polyimide precursor solution composition which comprises an aqueous solvent and has good environmental acceptability, and may provide a polyimide having high transparency, and having excellent properties such as flexibility, heat resistance, electrical properties, and solvent resistance, and preferably comprises a solvent containing no organic solvent other than water. In addition, according to the present invention, there may be provided an aqueous polyimide precursor solution composition which comprises a polyimide precursor (polyamic acid) having a high molecular weight. A polyimide having excellent properties may be obtained from the aqueous polyimide precursor solution composition. There have been no aqueous polyimide precursor solution compositions from which polyimides having such excellent properties can be obtained. Additionally, a polyimide having particularly high transparency may be obtained when using an aliphatic tetracarboxylic dianhydride and / or an aliphatic diamine having a molecular weight of 500 or less, or alternatively, when using an aromatic tetracarboxylic dianhydride containing a fluorine group (fluorine atom) and / or an aromatic diamine containing a fluorine group (fluorine atom).
[0060]The polyimide which is obtained from the aqueous solution composition of the polyimide precursor having a specific composition and prepared according to the present invention, in particular, has high transparency, and has excellent properties such as flexibility, heat resistance, electrical properties, and solvent resistance. Accordingly, the polyimide may be suitably used for an electrical device, an electronic device, and an optical device, and may be suitably used, for example, as a substrate, or a protective film for a display device such as a liquid crystal display, an EL display and an electronic paper, a touch panel, a solar battery, or an LED lighting device, or the like. The polyimide may be particularly suitably used as a substrate of a flexible device, for example, a display device such as a liquid crystal display, an organic EL display and an electronic paper, and a light-receiving device such as a light-receiving element of a thin-film solar battery.
[0061]According to the present invention, there may be also provided a polyimide precursor resin composition for flexible device substrates which comprises an aqueous solvent and has good environmental acceptability, and may provide a polyimide substrate for flexible device having high transparency, and having excellent properties such as flexibility, heat resistance, electrical properties, and solvent resistance, and being suitably usable as a substrate for flexible device as a display device such as substrates for a liquid crystal display, an organic EL display and an electronic paper, a substrate for flexible device as a light-receiving device such as a substrate for a thin-film solar battery, and the like, and preferably comprises a solvent containing no organic solvent other than water. The polyimide precursor resin composition for flexible device substrates is preferred because of having high environmental acceptability as compared with a polyimide precursor solution composition comprising an organic solvent. Moreover, the polyimide substrate for flexible device which is obtained from the polyimide precursor resin composition and has a specific composition may have high transparency, and have excellent properties such as flexibility, heat resistance, electrical properties, and solvent resistance, and therefore may be suitably used, for example, as a substrate for flexible device which is a display device such as substrates for a liquid crystal display, an organic EL display and an electronic paper, and as a substrate for flexible device which is a light-receiving device such as a substrate for a thin-film solar battery, in particular, which requires particularly high transparency and flexibility, and may be particularly suitably used as a substrate for a flexible display.
[0062]Moreover, according to the present invention, there may be provided a method for easily producing an aqueous polyimide precursor solution composition, which has higher environmental acceptability, without the need for a solvent other than water. According to the production method, an aqueous polyimide precursor solution composition, particularly an aqueous polyimide precursor solution composition comprising an aqueous solvent which has an organic solvent content of less than 5 wt %, further preferably contains no organic solvent, may be very easily (directly) produced. There have been no aqueous polyimide precursor solution compositions having such an extremely low organic solvent content. Now such an aqueous polyimide precursor solution composition may be produced by the production method of the present invention, which allows the reaction of a tetracarboxylic acid component and a diamine component in an aqueous solvent to form a polyimide precursor (polyamic acid).

Problems solved by technology

The polyamic acid solution composition to produce a polyimide contains an organic solvent and must be subjected to heat treatment at a high temperature, and therefore the polyamic acid solution composition is not necessarily environmentally friendly and in some cases, its application is limited.
Thus, extremely complicated operations are needed.
Moreover, an organic solvent cannot be completely removed from a water-soluble polyimide precursor prepared in the organic solvent.

Method used

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  • Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution
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  • Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution

Examples

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example 1

[0155]In a 500 mL (internal volume) glass reaction vessel equipped with a stirrer and a nitrogen-gas charging / discharging tube was placed 425 g of water as a solvent. And then, 20.97 g (0.184 mol) of t-CHDA, and 44.14 g (1.25 equivalents per carboxyl group) of 1,2-DMZ were added thereto, and the mixture was stirred at 25° C. for 1 hour to dissolve these compounds in water. Subsequently, 54.03 g (0.184 mol) of s-BPDA was added to the resulting solution, and the mixture was stirred at 70° C. for 6 hours to provide an aqueous polyimide precursor solution having a solid content of 12.8 wt %, a solution viscosity of 1.2 Pa·s, and an inherent viscosity of 0.72.

[0156]The aqueous polyimide precursor solution composition obtained was applied on a glass plate as a substrate with a bar coater. The resulting coating film was deaerated and predried at 25° C. for 30 minutes under reduced pressure. Subsequently, the predried coating film was placed into a hot air dryer and heated at 80° C. for 30 ...

example 2

[0158]In a 500 mL (internal volume) glass reaction vessel equipped with a stirrer and a nitrogen-gas charging / discharging tube was placed 425 g of water as a solvent. And then, 21.24 g (0.183 mol) of HMD, and 43.92 g (1.25 equivalents per carboxyl group) of 1,2-DMZ were added thereto, and the mixture was stirred at 25° C. for 1 hour to dissolve these compounds in water. Subsequently, 53.76 g (0.183 mol) of s-BPDA was added to the resulting solution, and the mixture was stirred at 70° C. for 6 hours to provide an aqueous polyimide precursor solution having a solid content of 12.4 wt %, a solution viscosity of 0.7 Pa·s, and an inherent viscosity of 0.63.

[0159]The aqueous polyimide precursor solution composition obtained was applied on a glass plate as a substrate with a bar coater. The resulting coating film was deaerated and predried at 25° C. for 30 minutes under reduced pressure. Subsequently, the predried coating film was placed into a hot air dryer and heated at 80° C. for 30 min...

example 3

[0161]In a 500 mL (internal volume) glass reaction vessel equipped with a stirrer and a nitrogen-gas charging / discharging tube was placed 425 g of water as a solvent. And then, 17.29 g (0.196 mol) of DAB, and 47.15 g (1.25 equivalents per carboxyl group) of 1,2-DMZ were added thereto, and the mixture was stirred at 25° C. for 1 hour to dissolve these compounds in water. Subsequently, 57.71 g (0.196 mol) of s-BPDA was added to the resulting solution, and the mixture was stirred at 70° C. for 6 hours to provide an aqueous polyimide precursor solution having a solid content of 12.2 wt %, a solution viscosity of 0.3 Pa·s, and an inherent viscosity of 0.45.

[0162]The aqueous polyimide precursor solution composition obtained was applied on a glass plate as a substrate with a bar coater. The resulting coating film was deaerated and predried at 25° C. for 30 minutes under reduced pressure. Subsequently, the predried coating film was placed into a hot air dryer and heated at 80° C. for 30 min...

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Abstract

An aqueous polyimide precursor solution composition in which a polyamic acid which is obtained by reacting a tetracarboxylic acid component and a diamine component is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 moles or more per mole of the tetracarboxylic acid component of the polyamic acid.

Description

TECHNICAL FIELD[0001]The present invention relates to an aqueous polyimide precursor solution composition and a method for easily producing an aqueous polyimide precursor solution composition. The aqueous polyimide precursor solution composition is preferred because of having high environmental acceptability as compared with a polyimide precursor solution composition comprising an organic solvent. The production method of the present invention does not require any solvent other than water, and therefore it may provide an aqueous polyimide precursor solution composition having a lower content of organic solvent than the conventional compositions, and may provide an aqueous polyimide precursor solution composition containing an aqueous solvent and containing no organic solvent, which has higher environmental acceptability. In addition, a polyimide may be suitably obtained from the aqueous polyimide precursor solution composition. A polyimide obtained from a specific aqueous polyimide ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08J5/18B29C39/00B29C39/38C08G73/10
CPCC08J5/18C08G73/10B29C39/006B29C39/38B29L2031/3475B29K2079/08B29K2105/0002B29K2105/0073C08J2379/08C08G73/1007C08K5/3445C08L2201/10C08L2201/08C08L2203/16C08L2203/204C08L2203/20C08L79/08Y10T428/31721
Inventor NAKAYAMA, TAKESHIGETAKASAKI, SUSUMUNAKAYAMA, TOMONORIHIROSHIGE, KENSUKE
Owner UBE IND LTD
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