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Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution

a technology of aqueous polyimide and precursor solution, which is applied in the direction of synthetic resin layered products, thin material processing, domestic applications, etc., can solve the problems of environmental protection, limited application, and inconvenient operation, and achieves good environmental acceptability, high transparency, and excellent properties such as flexibility and heat resistance. , the effect of high transparency

Inactive Publication Date: 2014-12-11
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an aqueous polyimide precursor solution composition that has good environmental acceptability and high transparency. It can be used for various applications such as flexible device substrates for displays, light-receiving devices, and electronic devices. The composition contains no organic solvent other than water and has excellent properties such as flexibility, heat resistance, electrical properties, and solvent resistance. The invention also provides a method for easily producing the aqueous polyimide precursor solution composition.

Problems solved by technology

The polyamic acid solution composition to produce a polyimide contains an organic solvent and must be subjected to heat treatment at a high temperature, and therefore the polyamic acid solution composition is not necessarily environmentally friendly and in some cases, its application is limited.
Thus, extremely complicated operations are needed.
Moreover, an organic solvent cannot be completely removed from a water-soluble polyimide precursor prepared in the organic solvent.

Method used

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  • Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution
  • Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution
  • Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution

Examples

Experimental program
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Effect test

example 1

[0155]In a 500 mL (internal volume) glass reaction vessel equipped with a stirrer and a nitrogen-gas charging / discharging tube was placed 425 g of water as a solvent. And then, 20.97 g (0.184 mol) of t-CHDA, and 44.14 g (1.25 equivalents per carboxyl group) of 1,2-DMZ were added thereto, and the mixture was stirred at 25° C. for 1 hour to dissolve these compounds in water. Subsequently, 54.03 g (0.184 mol) of s-BPDA was added to the resulting solution, and the mixture was stirred at 70° C. for 6 hours to provide an aqueous polyimide precursor solution having a solid content of 12.8 wt %, a solution viscosity of 1.2 Pa·s, and an inherent viscosity of 0.72.

[0156]The aqueous polyimide precursor solution composition obtained was applied on a glass plate as a substrate with a bar coater. The resulting coating film was deaerated and predried at 25° C. for 30 minutes under reduced pressure. Subsequently, the predried coating film was placed into a hot air dryer and heated at 80° C. for 30 ...

example 2

[0158]In a 500 mL (internal volume) glass reaction vessel equipped with a stirrer and a nitrogen-gas charging / discharging tube was placed 425 g of water as a solvent. And then, 21.24 g (0.183 mol) of HMD, and 43.92 g (1.25 equivalents per carboxyl group) of 1,2-DMZ were added thereto, and the mixture was stirred at 25° C. for 1 hour to dissolve these compounds in water. Subsequently, 53.76 g (0.183 mol) of s-BPDA was added to the resulting solution, and the mixture was stirred at 70° C. for 6 hours to provide an aqueous polyimide precursor solution having a solid content of 12.4 wt %, a solution viscosity of 0.7 Pa·s, and an inherent viscosity of 0.63.

[0159]The aqueous polyimide precursor solution composition obtained was applied on a glass plate as a substrate with a bar coater. The resulting coating film was deaerated and predried at 25° C. for 30 minutes under reduced pressure. Subsequently, the predried coating film was placed into a hot air dryer and heated at 80° C. for 30 min...

example 3

[0161]In a 500 mL (internal volume) glass reaction vessel equipped with a stirrer and a nitrogen-gas charging / discharging tube was placed 425 g of water as a solvent. And then, 17.29 g (0.196 mol) of DAB, and 47.15 g (1.25 equivalents per carboxyl group) of 1,2-DMZ were added thereto, and the mixture was stirred at 25° C. for 1 hour to dissolve these compounds in water. Subsequently, 57.71 g (0.196 mol) of s-BPDA was added to the resulting solution, and the mixture was stirred at 70° C. for 6 hours to provide an aqueous polyimide precursor solution having a solid content of 12.2 wt %, a solution viscosity of 0.3 Pa·s, and an inherent viscosity of 0.45.

[0162]The aqueous polyimide precursor solution composition obtained was applied on a glass plate as a substrate with a bar coater. The resulting coating film was deaerated and predried at 25° C. for 30 minutes under reduced pressure. Subsequently, the predried coating film was placed into a hot air dryer and heated at 80° C. for 30 min...

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Abstract

An aqueous polyimide precursor solution composition in which a polyamic acid which is obtained by reacting a tetracarboxylic acid component and a diamine component is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 moles or more per mole of the tetracarboxylic acid component of the polyamic acid.

Description

TECHNICAL FIELD[0001]The present invention relates to an aqueous polyimide precursor solution composition and a method for easily producing an aqueous polyimide precursor solution composition. The aqueous polyimide precursor solution composition is preferred because of having high environmental acceptability as compared with a polyimide precursor solution composition comprising an organic solvent. The production method of the present invention does not require any solvent other than water, and therefore it may provide an aqueous polyimide precursor solution composition having a lower content of organic solvent than the conventional compositions, and may provide an aqueous polyimide precursor solution composition containing an aqueous solvent and containing no organic solvent, which has higher environmental acceptability. In addition, a polyimide may be suitably obtained from the aqueous polyimide precursor solution composition. A polyimide obtained from a specific aqueous polyimide ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08J5/18B29C39/00B29C39/38C08G73/10
CPCC08J5/18C08G73/10B29C39/006B29C39/38B29L2031/3475B29K2079/08B29K2105/0002B29K2105/0073C08J2379/08C08G73/1007C08K5/3445C08L2201/10C08L2201/08C08L2203/16C08L2203/204C08L2203/20C08L79/08Y10T428/31721
Inventor NAKAYAMA, TAKESHIGETAKASAKI, SUSUMUNAKAYAMA, TOMONORIHIROSHIGE, KENSUKE
Owner UBE IND LTD
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