Heat-dissipation sheet assembly manufactured by using electrochemical method

a technology of heat-dissipation sheet and electrochemical method, which is applied in the direction of lighting and heating apparatus, semiconductor/solid-state device details, soldering apparatus, etc., can solve the problems of increasing structural complexity and preciseness, and the heat-dissipation sheet layer b>91/b> may be peeled off or damaged, so as to achieve the effect of easy separation from the adhesion layer

Inactive Publication Date: 2014-12-18
A TECH SOLUTION
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  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0015]Preferably, the heat-dissipation sheet assembly may further comprise an adhesion layer to attach the heat-dissipation sheet assembly to the

Problems solved by technology

Recently, the structural complexity and preciseness have more and more increased in various electrical and electronic equipment including televisions, computers, medical devices, office equipment, communication equipment, etc.
Furthermor

Method used

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  • Heat-dissipation sheet assembly manufactured by using electrochemical method
  • Heat-dissipation sheet assembly manufactured by using electrochemical method
  • Heat-dissipation sheet assembly manufactured by using electrochemical method

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Embodiment Construction

[0021]The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which the preferred embodiments of the invention are shown so that those of ordinary skill in the art can easily carry out the present invention.

[0022]FIGS. 2 and 3 are schematic cross-sectional views of heat-dissipation sheet assemblies 10, 10′ according to the present invention. FIG. 2 is a cross-sectional view of the heat-dissipation sheet assembly 10 according to one embodiment of the present invention, wherein a protection layer 12 is electrodeposited on only one side of a heat-dissipation sheet 11. FIG. 3 is a cross-sectional view of the heat-dissipation sheet assembly 10′ according to another embodiment of the present invention, wherein protection layers 12, 12′ are electrodeposited on and under a heat-dissipation sheet layer 11.

[0023]As shown in FIGS. 2 and 3, the heat-dissipation sheet assemblies 10, 10′ comprise the heat-dissipation sheet layer 11 having...

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Abstract

There is provided a heat-dissipation sheet assembly comprising a heat-dissipation sheet layer having good heat conductivity and a protection layer(s) electrodeposited on one or both sides of the heat-dissipation sheet layer. When the heat-dissipation sheet layer is immersed in an aqueous solution for electrodeposition added with a material for electrodeposition and electric current is permitted to flow in the aqueous solution, the protection layer(s) is electrodeposited on the one or both sides of the heat-dissipation sheet layer. The heat-dissipation sheet assembly can be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2013-0069480, filed on Jun. 18, 2013, the disclosure of which is hereby incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a heat-dissipation sheet assembly and more particularly, to a heat-dissipation sheet assembly manufactured by using an electrochemical method.[0004]2. Description of the Related Art[0005]Recently, the structural complexity and preciseness have more and more increased in various electrical and electronic equipment including televisions, computers, medical devices, office equipment, communication equipment, etc. As the electrical and electronic components which are used in these devices and equipment have become smaller in size and the quantity thereof has increased, the heat generated in these components has increased. To efficiently release and disperse t...

Claims

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Application Information

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IPC IPC(8): F28F21/08F28F21/02F28F3/00
CPCF28F21/081F28F3/00F28F21/02F28F21/089H01L23/373H01L23/3735H01L23/3736H01L2924/0002Y10T428/1443Y10T428/12882Y10T428/1275Y10T428/1438H01L2924/00
Inventor KIM, JONG SEOPLEE, KI SUNG
Owner A TECH SOLUTION
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