Method for Forming Three Dimensional Circuit
a three-dimensional circuit and circuit technology, applied in the direction of manufacturing tools, liquid/solution decomposition chemical coating, conductive material removal by irradiation, etc., can solve the problems of complex process, high cost of base materials, and inability to solve the problem of complex process, etc., to save manufacturing costs, easy to import, and simple design process of three-dimensional circui
Inactive Publication Date: 2015-03-05
LIU WEI LIN
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Benefits of technology
The patent describes a way to design and manufacture electronic circuits using a three-dimensional printing process. This method is simple and can use existing equipment, saving money on tooling. The process also allows for the creation of more complex circuits, which can be used in slimmer and lighter electronic devices. Overall, this technology makes it easier to design and manufacture new electronic circuits, which can help meet the growing demand for small and efficient electronics.
Problems solved by technology
The photolithography imaging resolution and is proportional to the wavelength of the light source, so the resolution has its limits, and these processes are very complex and expensive.
For the non-flat surface transfer circuit technology is necessary, but for traditional photolithography process, even a slight surface will because the depth of focus is insufficient for transferring the pattern on the non-flat surface even the surface is a slight curve surface.
However, the base material price is expensive, and the desired circuit pattern region for the laser engraving has long working hours.
Method used
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[0012]Please refer to FIG. 1. FIG. 1 shows a process flow of the three dimensional circuit forming method of the present invention. The steps of the process flow includes a plastic base is provided as denoted as step S1. A metal layer is bonded on a surface of the plastic base to form a coating film on the plastic base as denoted as step S2. The thickness of the metal layer is thickened by an electroplating process as denoted as step S3. The metal layer is trimmed by a laser engraving process to form a circuit pattern as denoted as step S4.
[0013]Please refer to FIG. 2 through FIG. 4. The material of the plastic base 10 such as a print circuit board or a plastic case which is formed by injection molding, in which the surface of the plastic base 10 can be a flat surface or non-flat surface. The plastic base 10 includes a first surface 11 and a second surface 12 opposite to the first surface 11. The metal layer 20 is bonded on one surface of the first surface 11 and the second surface ...
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Abstract
A method for a forming three dimensional circuit is provided. A plastic base is provided. A metal layer is bonded on the plastic base by a metal coating process. The thickness of the metal layer is thickened by an electroplating process. The metal layer is trimmed to form a circuit pattern thereon by a laser engraving process, whereby, the working-hours can be reduced and the cost of material can also be reduced when the three dimensional circuit is manufactured.
Description
FIELD OF THE INVENTION[0001]The present invention relates to a method for forming a three dimensional circuit, and in particular to the three dimensional circuit is formed by a laser engraving process.BACKGROUND OF THE INVENTION[0002]The microlithography process in the traditional semiconductor industry lithography and the associated micro-fabrication technology is based on photolithography etching process. The photolithography imaging resolution and is proportional to the wavelength of the light source, so the resolution has its limits, and these processes are very complex and expensive.[0003]In recently, the circuit type of microelectronic circuit which is circuit gradually progress from two dimensional circuit to three dimensional circuit. For the non-flat surface transfer circuit technology is necessary, but for traditional photolithography process, even a slight surface will because the depth of focus is insufficient for transferring the pattern on the non-flat surface even the...
Claims
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IPC IPC(8): H05K3/02C23C14/34C25D7/12B23K26/36
CPCH05K3/027C25D7/12C23C14/34B23K26/365C25D5/48C23C18/1653H05K1/0284H05K2201/09118
Inventor LIU, WEI-LIN
Owner LIU WEI LIN