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Aqueous processing liquid

Inactive Publication Date: 2015-05-14
IDEMITSU KOSAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present patent is about a process for preparing a processing liquid by blending components in a certain concentration or by using a concentrated liquid and diluting it. The concentrated liquid can be made with a volume magnification of up to 160 times. The technical effect of this invention is to provide a convenient and flexible method for preparing a processing liquid in different concentrations and volumes, which can be used in various applications.

Problems solved by technology

According to the loose abrasive grain method, a large margin is required when a thick wire is used, so that a large amount of cut powder is generated to deteriorate a yield after cutting the ingot.
In addition, since the wire becomes worn as being used, there is a limit to reduce a diameter of the wire itself.
Accordingly, the loose abrasive grain method is not productive in the manufacturing a silicon wafer for a solar battery and the like, which is expected to be significantly increasingly produced in the future.

Method used

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Examples

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examples

[0036]Next, the invention will be described in detail with reference to Examples and Comparatives, but the scope of the invention is by no means limited by the Examples and Comparatives.

examples 1 to 6

, Comparatives 1 to 3

[0037]Aqueous processing liquids (sample liquids) of compositions shown in Table 1 were prepared and subjected to the following cut processing for evaluation. Evaluation results are also shown in Table 1.

TABLE 1Exam-Exam-Exam-Exam-Exam-Exam-Compar-Compar-Compar-ple 1ple 2ple 3ple 4ple 5ple 6ative 1ative 2ative 3Composition ofEthyleneoxide-propyleneoxide block1.03.06.38.3—10.5—12.5—Sample Liquidscopolymer (Mw13,000) *1(mass %)Polyethylene Glycol (Mw20,000) *2————6.0————Polyacrylic Acid (Mw798,000) *3————————1.5Ion-Exchange Water99.097.093.791.794.089.5100.087.598.5Total100.0100.0100.0100.0100.0100.0100.0100.0100.0Viscosity of(25° C. mPa · s)1.52.95.18.18.212.01.020.55.1Sample LiquidsEvaluationAccuracy of Silicon Wafer (TTV) (μm)431929333240broken6248ResultsAccuracy of Silicon Wafer (SORI) (μm)423638484750broken6055*1 ethyleneoxide-propyleneoxide block copolymer having a mass average molecular weight of 13,000*2 polyethylene glycol having a mass average molecular ...

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Abstract

An aqueous processing liquid used for cutting a fragile material using a wire saw contains a water-soluble polymer, in which the water-soluble polymer has a mass average molecular weight in a range of 3×103 to 6×105, and the aqueous processing liquid exhibits a viscosity at 25 degrees C. in a range of 1.5 mPa·s to 15 Pa·s.

Description

TECHNICAL FIELD[0001]The present invention relates to an aqueous processing liquid, more specifically, an aqueous processing liquid used for cutting a fragile material with a fixed abrasive grain wire saw.BACKGROUND ART[0002]In manufacturing semiconductor products, a silicon ingot (that is fragile in nature) needs to be cut. In such a case, a wire saw processing is generally employed in terms of cutting accuracy and productivity. Herein, a cutting method of the silicon ingot includes: a loose abrasive grain method of cutting the silicon ingot with a processing liquid in which grains are dispersed; and a fixed abrasive grain method of cutting the silicon ingot with a wire having grains fixed on its surface in advance.[0003]A processing liquid used for the loose abrasive grain method is exemplified by an aqueous processing liquid containing a friction-coefficient reducer, an anticorrosion adjuvant and the like. An unsaturated fatty acid is used as the friction-coefficient reducer cont...

Claims

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Application Information

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IPC IPC(8): C10M107/34
CPCC10M107/34B28D5/007C10M173/02C10M2209/084C10M2209/104C10M2209/103C10N2020/04C10N2020/02C10N2030/02C10N2040/22Y02P70/10C10M2209/105
Inventor KITAMURA, TOMOHIKO
Owner IDEMITSU KOSAN CO LTD
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