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Substrate processing apparatus and substrate processing method

a substrate processing and processing apparatus technology, applied in the direction of cleaning process and apparatus, cleaning using liquids, semiconductor/solid-state device testing/measurement, etc., can solve problems such as poor drying

Inactive Publication Date: 2015-09-24
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technical effect of this patent is to successfully detect the condition of a processing liquid on a substrate and to safely dry the substrate's surface. The method involves heating the substrate and covering it with a liquid film of the processing liquid, which forms a gaseous phase across the substrate and raises the liquid film over the substrate. This process offers the same benefits as traditional methods and ensures a safe and effective cleaning process.

Problems solved by technology

In such a spin drying step, it may not be possible to sufficiently remove rinse liquid getting into a pattern formed on the substrate, which may result in poor drying.

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

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first preferred embodiment

[0106]FIG. 1 is a schematic plan view of a substrate processing apparatus 1 according to a first preferred embodiment of the present invention. FIG. 2 is a schematic vertical cross-sectional view of a processing unit 202 included in the substrate processing apparatus 1 shown in FIG. 1.

[0107]The substrate processing apparatus 1 is a single substrate processing type in which disk-shaped substrates W such as silicon wafers are processed one by one. As shown in FIG. 1, the substrate processing apparatus 1 includes multiple processing units 202 arranged to process the substrates W with processing liquid, load ports LP on which carriers C are placed to house the respective multiple substrates W to be processed in the processing units 202 therein, delivery robot IR and delivery robot CR arranged to deliver the substrates W between the load ports LP and the processing units 202, and a controller 3 arranged to control the substrate processing apparatus 1.

[0108]The processing units 202 are si...

second preferred embodiment

[0253]Next will be described a second preferred embodiment of the present invention. In FIG. 32 and the following figures, components equivalent to those shown in FIGS. 1 to 31 are designated by the same reference symbols as in, for example, FIG. 1 and description thereof shall be omitted.

[0254]As shown in FIG. 32, the processing unit 2 includes a first substrate holding unit 15 arranged to rotate a substrates W about a vertical axis of rotation A1 passing through the center of the substrate W while keeping the substrate W in a horizontal attitude and a second substrate holding unit 29 arranged to heat the substrate W while keeping the substrate W in a horizontal attitude. The first substrate holding unit 15 and the second substrate holding unit 29 are examples of the substrate holding unit.

[0255]As shown in FIG. 32, the processing unit 2 further includes an openable / closable inner chamber 7 to house the first substrate holding unit 15 and the second substrate holding unit 29 therei...

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Abstract

In parallel with a substrate heating step, a liquid surface sensor is used to monitor the raising of an IPA liquid film. An organic solvent removing step is started in response to the raising of the IPA liquid film over the upper surface of the substrate. At the end of the organic solvent removing step, a visual sensor is used to determine whether or not IPA droplets remain on the upper surface of the substrate.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a substrate processing apparatus and a substrate processing method which process a substrate. Examples of the substrate to be processed include semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma display devices, substrates for FED (Field Emission Display) devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks and substrates for photo masks.[0003]2. Description of the Related Art[0004]In semiconductor device manufacturing processes, the front surface of substrates such as semiconductor wafers is processed with processing liquid. Substrate processing apparatuses of a single substrate processing type, in which substrates are processed one by one, include a spin chuck arranged to rotate a substrate while holding the substrate thereon approximately horizontally and a nozzle arranged to supply processin...

Claims

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Application Information

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IPC IPC(8): H01L21/67B08B3/10
CPCB08B3/10H01L21/67028H01L21/67103H01L21/6715H01L21/67253H01L21/67288H01L21/68742H01L21/02046H01L21/67017H01L22/30H01L21/324H01L21/02041
Inventor YOSHIHARA, NAOHIKOKOBAYASHI, KENJIOKUTANI, MANABU
Owner DAINIPPON SCREEN MTG CO LTD
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