Method for manufacturing layered electronic devices

a technology of electronic devices and manufacturing methods, applied in the field of printed electronic devices, can solve the problems of inability to manufacture optimal designs of electronic devices, performance sacrifice, and devices that have yet to find effective methods to fully integrate electrical function and mechanical structur

Inactive Publication Date: 2018-02-22
HAMILTON SUNDSTRAND CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a method for making printed electronics by adding layers of different electrical components onto a substrate. The layers can be modified after printing, such as by heating or cutting the substrate. The result is an assembled electrical device that can be used for various applications. The method allows for the fabrication of complex and customizable electrical devices on flexible substrates.

Problems solved by technology

With conventional methods, EM devices having optimal designs are often not easily manufacturable.
Performance is then sacrificed due to processing constraints.
However, preliminary explorations of conventional AM for EM devices have yet to find effective methods to fully integrate electrical function with mechanical structure.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing layered electronic devices
  • Method for manufacturing layered electronic devices
  • Method for manufacturing layered electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015]Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, a partial view of an exemplary embodiment of the method of manufacturing printed electronic devices in accordance with the disclosure is shown in FIG. 1 and is designated generally by reference character 100. Other embodiments of methods in accordance with the disclosure, or aspects thereof, are provided in FIGS. 2-3, as will be described.

[0016]One limitation of traditional techniques of using additive manufacturing to manufacture printed electromagnetic devices is the inability to create structures that differ substantially in size, functionality, and accuracy and yet can also provide the needed material diversity wherein the materials have acceptable properties in comparison to other forming techniques. This is particularly true when attempting to create multicom...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thermal conductivityaaaaaaaaaa
dielectric strengthaaaaaaaaaa
magnetic permeabilityaaaaaaaaaa
Login to View More

Abstract

A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a divisional of U.S. patent application Ser. No. 14 / 333,856 filed Jul. 17, 2014, which claims the benefit of priority to U.S. Provisional Patent Application No. 62 / 021,571 filed Jul. 7, 2014, each of which is incorporated by reference herein in its entirety.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present disclosure relates to electronic devices, and more particularly to printed electronic devices.2. Description of Related Art[0003]Electromagnetic (EM) devices such as motors, inductors, sensors, etc. are often manufactured using lamination and winding or etching of electrical conductors. The materials in the assembly are selected for specific properties, for example, electrical or thermal conductivity, dielectric strength, and magnetic permeability. The three dimensional organization of these materials is critical for optimization of device performance.[0004]With conventional methods, EM devices ha...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(United States)
IPC IPC(8): H05K1/16H05K3/12C23C18/16H05K1/02H05K1/09H05K3/46H05K3/36B32B37/06
CPCH05K2203/06B32B2305/72H05K1/092H05K1/0298H05K3/36H05K3/12H05K1/165C23C18/1633H05K1/16H05K2203/1105H05K2201/0129H05K2201/0125H05K3/4617B32B37/06
InventorCULP, SLADE R.DARDONA, SAMEHSCHMIDT, WAYDE R.
OwnerHAMILTON SUNDSTRAND CORP