Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device

a technology of light-emitting devices and flexural resistance, which is applied in the direction of solid-state devices, layered products, chemistry apparatuses and processes, etc., can solve the problems of limited practical utility, insufficient reliability, and inability to use flexible light-emitting devices, so as to prevent cracks or breakage, improve adhesion, and improve flexural resistance or heat-cycle characteristics

Inactive Publication Date: 2018-03-15
TOSHIBA HOKUTO ELECTRONICS CORP
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution provides a light-emitting device with improved flexural resistance and heat-cycle characteristics, preventing cracks and ensuring persistent lighting under severe conditions by enhancing the adhesion and mechanical integrity between the elastomer and electroconductive layers.

Problems solved by technology

Unless reliabilities are satisfied so as to clear the above-mentioned repetitive environmental conditions and operating conditions, the use of a flexible light-transmissive light-emitting device will be restricted extremely.
From such viewpoints, the light-emitting devices disclosed in Patent documents 3, 4, and 5 lack sufficient reliabilities and the practical utilities thereof were limited.
Moreover, the light-emitting devices disclosed in Patent documents 3, 4 and 5 are accompanied with problems that, under application of a pressure during the production thereof, electrode edges formed on the light-emitting device, the concavities and convexities formed on the electrodes, a level difference at edges of an active layer and the device substrate, etc., are abutted against the light-transmissive conductive layer of a light-transmissive electroconductive member, thus being liable to result in a crack in or breakage of the light-transmissive conductive layer and cause disconnection leading to a lowering in production yield and an increase in production cost.
Furthermore, since the light-emitting devices disclosed in Patent documents 3, 4 and 5 are accompanied with fine cracks in the light-transmissive conductive layer of light-transmissive electroconductive member during the production thereof in many cases, thus being liable to cause lighting failure in case of being bent or under application of a heat cycle, even if they are lighting immediately after production.
Furthermore, since the light-emitting devices disclosed in Patent documents 4 and 5 are insufficient in contact between the light-transmissive conductive layer and the LED electrodes, they have poor resistance to bending and leave a problem in reliability after application of heat or thermal cycles.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device
  • Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device
  • Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0052]FIG. 1 is a sectional view of an essential part of a light-emitting device according to a first embodiment.

[0053]A light-emitting device 1, includes: an LED chip 10 including an LED body 11 and first and second electrode layers 15 (15A, 15B) formed on a front and a back face, respectively, of the LED body 11; first and second light-transmissive electroconductive members 20 (20A, 20B) respectively covering the LED chip 10 and including transparent substrates 21 (21A, 21B) and first and second light-transmissive electroconductive layers 25 (25A, 25B); and a light-transmissive elastomer layer 30 joined to a circumference 13 of the LED chip 10 and also to the light-transmissive electroconductive layer 25A of the light-transmissive electroconductive member 20A and the light-transmissive electroconductive layer 25B of the light-transmissive electroconductive member 20B.

[0054]In short, the light-emitting device 1 is formed by sandwiching the LED chip 10 with two sheets of the light-t...

second embodiment

[0148]FIG. 14 is a sectional view of a light-emitting device of a second embodiment. Compared with the light-emitting device 1 shown in FIG. 1 as a first embodiment, the light-emitting device 1A is different in that it includes an LED chip 10A having two types of electrodes 15A and 15B on one face thereof in place of the LED chip 10, a transparent substrate 21D having no light-transmissive electroconductive layer 25 in place of the first light-transmissive electroconductive member 20A, and a light-transmissive electroconductive member 20C having two types of light-transmissive electroconductive layers 25A and 25B in place of the second light-transmissive electroconductive member 20B, and the other structure is identical to the light-emitting device 1. Accordingly, with respect to the light-emitting device 1A shown in FIG. 14 as a second embodiment, the same components as those in the light-emitting device 1 shown in FIG. 1 as a first embodiment are denoted by identical symbols or nu...

example 1

[Example 1] (Two-Face Electrode-Type LED Device)

[0228]A strip-shaped LED device having a general structure including a length of about 90 mm and a width of about 50 mm was prepared by disposing six two-face electrode-type LED chips connected in series and arranged in a straight line with a spacing of about 5 mm from each other and disposing a pair of elastomer sheets respectively over the two faces of electrodes, followed by sandwiching with a pair of light-transmissive electroconductive member sheets and hot vacuum pressing. A partial laminate structure thereof was similar as shown in FIGS. 1 and 2. Details thereof are described below.

(LED Chip)

[0229]As LED chips, GaAlAs / GaAs-based red luminescence LED chips (planar size: about 300×300 μm, whole thickness (height): 175 μm) having electrodes on both front and back faces, were provided.

[0230]The electrode layers on both faces of each LED chip included a substrate side electrode layer (15A) comprising a 3.5 μm-thick Au layer electrica...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
heightaaaaaaaaaa
heightaaaaaaaaaa
surface roughness Raaaaaaaaaaa
Login to View More

Abstract

A light-emitting device includes a pair of light-transmissive insulator sheets disposed opposite to each other and two types of light-transmissive electroconductive layers disposed on a common one of or separately on one and the other of the pair of light-transmissive insulator sheets, and at least one light-emitting semiconductor each provided with a cathode and an anode which are individually and electrically connected to the two types of the light-transmissive electroconductive layers. The electrical connection and mechanical bonding between the members are improved by a light-transmissive elastomer which is between the pair of light-transmissive insulator sheets. A method in which a light-emitting semiconductor element and a light-transmissive electroconductive member are subjected to vacuum hot-pressing.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of U.S. application Ser. No. 14 / 771,816, filed Sep. 1, 2015, which in turn is the National Stage of International Application No. PCT / JP2014 / 058747, filed Mar. 27, 2014, which is based on and claims the priorities of Japanese Application No. 2013-069988, filed Mar. 28, 2013, and Japanese Application No. 2013-069989, filed Mar. 28, 2013, of each of which the benefits are claimed herein and the entire disclosures of each are incorporated herein by reference.FIELD OF THE INVENTION[0002]The embodiments relate to a light-transmissive light-emitting device equipped with light-emitting elements, its production method, and an apparatus using the light-emitting device.BACKGROUND OF THE INVENTION[0003]A light-transmissive light-emitting device is formed by electrically connecting electrodes disposed on light-emitting elements to light-transmissive electroconductive layers on a substrate. As the connection method, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L33/54H01L33/56H01L33/38H01L33/62B32B17/10H01L25/075
CPCH01L33/38B32B17/10036H01L33/387H01L25/0753H01L33/54H01L2933/005H01L2224/16225H01L33/56H01L2924/07811H01L33/62H01L2924/00H01L2924/00014H01L2924/12041
InventorMAKI, KEIICHI
OwnerTOSHIBA HOKUTO ELECTRONICS CORP