Heat dissipation sheet and method for manufacturing heat dissipation sheet

a heat dissipation sheet and heat dissipation sheet technology, which is applied in the direction of lighting, heating apparatus, and semiconductor/solid-state device details, etc., can solve the problems of sacrificing the flexibility affecting the efficiency of the heat dissipation sheet, etc., to achieve high thermal conductive properties, the effect of sufficient flexibility
US20190063854A1Inactive Publication Date: 2019-02-28TOYOTA JIDOSHA KK
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
TOYOTA JIDOSHA KK
Publication Date
2019-02-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

A heat dissipation sheet includes a resin material and a heat dissipation member that is made of a material with a higher thermal conductivity than the resin material. The heat dissipation member has protrusion bands and recess bands that are alternately arranged in parallel with one another. Top surfaces of the protrusion bands are flush with each other, and are located in a first horizontal surface. Bottom surfaces of the recess bands are flush with each other, and are located in a second horizontal surface. A first slit is provided between the top surfaces of the adjacent protrusion bands. A second slit is parallel to the first slit is provided between the bottom surfaces of the adjacent recess bands. Portions of the heat dissipation member other than both the top surfaces of the protrusion bands and the bottom surfaces of the recess bands are buried in the resin material.
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Description

INCORPORATION BY REFERENCE

[0001] The disclosure of Japanese Patent Application No. 2017-165421 filed on Aug. 30, 2017 including the specification, drawings and abstract is incorporated herein by reference in its entirety.BACKGROUND1. Technical Field

[0002] The disclosure relates to a heat dissipation sheet that is suitable for dissipating heat generated from, for example, an electronic component generating heat to the outside and a method for manufacturing a heat dissipation sheet.2. Description of Related Art

[0003] Electronic components that generate heat on their own, such as a central processing unit (CPU), are likely to operate improperly when the temperature increases excessively. In order to avoid such improper operation, an appropriate cooling device is used together with an electronic component. Examples of the cooling device as described above include the heat dissipation sheet described in Japanese Unexamined Patent Application Publication No. 2001-291810 (JP 2001-291810 A), t...

Claims

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