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Semiconductor device

a technology of semiconductors and devices, applied in the direction of semiconductor devices, electrical equipment, transistors, etc., can solve the problem of limiting the scaling law,

Inactive Publication Date: 2020-07-09
SEMICON ENERGY LAB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The transistor maintains switching characteristics even with short channel lengths and reduces off-state current by minimizing the influence of short-channel effects, enabling highly integrated semiconductor devices with improved reliability.

Problems solved by technology

However, in recent years, the limit of the scaling law has become a problem.

Method used

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  • Semiconductor device
  • Semiconductor device
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Examples

Experimental program
Comparison scheme
Effect test

embodiment 1

[0090]In this embodiment, a transistor according to one embodiment of the present invention will be described.

[0091]FIG. 1A is a top view of a transistor according to one embodiment of the present invention. FIG. 1B is a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 1A. FIG. 1C is a cross-sectional view taken along dashed-dotted line A3-A4 in FIG. 1A. Note that a base insulating film 102 and the like are not illustrated in FIG. 1A for simplicity.

[0092]In FIG. 1A, the channel length (L) and the channel width (W) of the transistor are shown. Note that the channel region of the transistor corresponds to a region of an oxide semiconductor film 106 overlapping with a gate electrode 104. At least part of two side surfaces of the oxide semiconductor film 106 overlap with the gate electrode 104.

[0093]In the transistor illustrated in FIG. 1A, the channel length is greater than or equal to 5 nm and less than 60 nm, and the channel width is greater than or equal to 5 nm and...

embodiment 2

[0219]In this embodiment, a transistor having a different structure from any of the transistors in Embodiment 1 will be described.

[0220]FIG. 7A is a top view of a transistor according to one embodiment of the present invention. FIG. 7B is a cross-sectional view taken along dashed-dotted line E1-E2 in FIG. 7A. FIG. 7C is a cross-sectional view taken along dashed-dotted line E3-E4 in FIG. 7A. Note that a base insulating film 202 and the like are not illustrated in FIG. 7A for simplicity.

[0221]In FIG. 7A, the channel length (L) and the channel width (W) of the transistor are shown. Note that the channel region of the transistor corresponds to a region of an oxide semiconductor film 206 overlapping with a gate electrode 204. At least two side surfaces of the oxide semiconductor film 206 overlap with the gate electrode 204.

[0222]In the transistor illustrated in FIG. 7A, the channel length is greater than or equal to 5 nm and less than 60 nm, and the channel width is greater than or equal...

embodiment 3

[0255]In this embodiment, a transistor having a different structure from any of the transistors in Embodiments 1 and 2 will be described.

[0256]FIG. 9A is a top view of a transistor according to one embodiment of the present invention. FIG. 9B is a cross-sectional view taken along dashed-dotted line F1-F2 in FIG. 9A. FIG. 9C is a cross-sectional view taken along dashed-dotted line F3-F4 in FIG. 9A. Note that a base insulating film 302 and the like are not illustrated in FIG. 9A for simplicity.

[0257]In FIG. 9A, the channel length (L) and the channel width (W) of the transistor are shown. Note that the channel region of the transistor corresponds to a region of an oxide semiconductor film 306 overlapping with a gate electrode 304. At least two side surfaces of the oxide semiconductor film 306 overlap with the gate electrode 304.

[0258]In the transistor illustrated in FIG. 9A, the channel length is greater than or equal to 5 nm and less than 60 nm, and the channel width is greater than o...

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Abstract

A transistor in which a short-channel effect is not substantially caused and which has switching characteristics even in the case where the channel length is short is provided. Further, a highly integrated semiconductor device including the transistor is provided. A short-channel effect which is caused in a transistor including silicon is not substantially caused in the transistor including an oxide semiconductor film. The channel length of the transistor including the oxide semiconductor film is greater than or equal to 5 nm and less than 60 nm, and the channel width thereof is greater than or equal to 5 nm and less than 200 nm. At this time, the channel width is made 0.5 to 10 times as large as the channel length.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The present invention relates to a semiconductor device and a method of manufacturing the semiconductor device.[0002]Note that in this specification, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics, and an electro-optical device, a semiconductor circuit, an electronic device, and the like are all included in the category of semiconductor devices.2. Description of the Related Art[0003]The integration degree of a semiconductor device including silicon has been increased with miniaturization obeying the scaling law of a transistor or the like, and thus a reduction in power consumption and an improvement in performance have been achieved.[0004]However, in recent years, the limit of the scaling law has become a problem. For example, when the channel length is short, a so-called short-channel effect such as a punch-through phenomenon becomes noticeable.[0005]Further, it is kn...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L29/786H01L27/12H01L29/04H01L29/49
CPCH01L27/1225H01L27/1255H01L29/7869H01L29/04H01L29/78696H01L29/4908
Inventor YAMAZAKI, SHUNPEIMATSUBAYASHI, DAISUKEOKAZAKI, YUTAKA
Owner SEMICON ENERGY LAB CO LTD