Ceramic substrate and method for manufacturing ceramic substrate
a ceramic substrate and ceramic technology, applied in the direction of lithography/patterning, conductive pattern formation, non-metallic protective coating application, etc., can solve the problems of resist pattern that is applied, solder spreads out between the electrodes, and resists spread out when the components are applied, so as to prevent the effect of resist spreading
Inactive Publication Date: 2021-07-22
MURATA MFG CO LTD
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- Abstract
- Description
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- Application Information
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Benefits of technology
The solution effectively prevents solder spread between electrodes, enhances work efficiency during component mounting, and maintains high coplanarity around interelectrode wires, improving the overall manufacturing process.
Problems solved by technology
In the case where the electrodes are coated with the covers, and the interelectrode wires are not coated with covers, there is a problem in that solder spreads out between the electrodes when the components are mounted.
This method, however, has a problem in that the resist pattern that is applied spreads because there are steps formed by the electrodes and the interelectrode wires when the resist pattern is applied.
Method used
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example 1
[0075]A ceramic green sheet including a plurality of electrodes and interelectrode wires connecting the electrodes to each other was prepared by applying a conductive paste containing Cu to the ceramic green sheet by screen printing. Separately, a resist paste containing the same ceramic material as the ceramic material of which the ceramic green sheet was made was applied to a PET release film to form resist patterns. A transfer sheet formed of a PET resin sheet and the release film were stacked and pressure-bonded, and the resist patterns were transferred to the transfer sheet. Subsequently, the ceramic green sheet and the transfer sheet were stacked such that the resist patterns extended across the interelectrode wires and pressure-bonded. The transfer sheet was separated to transfer the resists such that the resists on the transfer sheet extended across the interelectrode wires. Subsequently, the ceramic material of which the ceramic green sheet was made was fired at the firing ...
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Abstract
A ceramic substrate includes an electrode on an electronic component mounting surface. A resist dividing the electrode into a plurality of electrode pieces by extending across the electrode is disposed on the electronic component mounting surface. Two of the electrode pieces may be connected to each other by a portion of the electrode that is concealed under the resist.
Description
CROSS REFERENCE TO RELATED APPLICATIONS[0001]This is a continuation of U.S. patent application Ser. No. 16 / 394,459 filed on Apr. 25, 2019, which is a continuation of International Application No. PCT / JP2017 / 038264 filed on Oct. 24, 2017 which claims priority from Japanese Patent Application No. 2016-220913 filed on Nov. 11, 2016. The contents of these applications are incorporated herein by reference in their entireties.BACKGROUND OF THE DISCLOSUREField of the Disclosure[0002]The present disclosure relates to a ceramic substrate and a method for manufacturing the ceramic substrate.Description of the Related Art[0003]A ceramic substrate has a first surface that is to be connected to a motherboard and a second surface on which electronic components are mounted.[0004]Patent Document 1 discloses a method of coating electrodes on an upper surface of a ceramic multilayer substrate with covers in order to increase the strength of close contact between the substrate and pads (electrodes). S...
Claims
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IPC IPC(8): H05K1/03H05K3/12H05K3/34H05K3/28H05K1/11
CPCH05K1/0306H05K3/1291H05K1/181H05K3/28H05K1/111H05K3/34H05K3/3452H05K2201/09036H05K3/4629H05K2203/0537
InventorMINO, YOSUKE
OwnerMURATA MFG CO LTD