Chemical-mechanical polishing pad with protruded structures

Abstract

A polishing pad includes a supporting layer and a protruded pattern disposed on the supporting layer. The protruded pattern includes a horizontal extended surface and a vertical side surface. Further, the supporting layer includes a first supporting layer and a second supporting layer, and the first supporting layer is disposed on the second supporting layer. In particular, a variation of a horizontal cross-sectional area of the protruded pattern is equal to or less than 50% along a protrusion direction.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority from U.S. Provisional Application No. 63 / 013,064 filed on Apr. 21, 2020, which application is incorporated herein by reference in its entirety.TECHNICAL FIELD[0002]The present disclosure relates to chemical-mechanical polishing, and more particularly, to chemical-mechanical polishing pads with protruded structures for improved thermal stability and improved consistency of polishing surface roughness.RELATED ART[0003]Chemical-mechanical polishing (CMP) is used in semiconductor fabrication processes for smoothing uneven or undulated patterns on the wafer surface. The CMP process flattens the surface of a wafer or a manufacturing article on the atomic level, while minimizing surface defects, using interactions of frictional and chemical energies. Polishing is achieved by generating a relative motion between a manufacturing article and a polishing pad while pressing down the manufacturing article on the polishi...

AI Technical Summary

Benefits of technology

The patent describes the design and manufacturing of polishing pads used in semiconductor or optical component manufacturing. These pads have improved thermal stability and can maintain a consistent surface roughness during polishing processes. This results in better quality components and more efficient manufacturing processes.

Problems solved by technology

Therefore, although an ability to tightly control the pressure and the relative velocity generally improves the polishing stability or repeatability, a complex matrix of variations in consumable parts and polishing conditions even during the process significantly impacts the polishing stability.

However, as the polishing process proceeds, the frictional heat from the polishing process accumulates in the equipment, and the process temperature deviates, causing degradation of the polishing stability and repeatability.

In addition, another factor that degrades the polishing stability is the consistency of the pad surface.

However, the roughness of the polishing surface varies over time.

Since numerous factors such as the size and distribution of the diamond particles, pressure, conditioning method, and the stability of the conditioning tool govern the conditioning results, it is difficult to consistently maintain the surface condition of the polishing pad.

As a result, the surface roughness of the conventional polishing pads in the related art is unstable.

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