Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same

Inactive Publication Date: 2002-01-01
MURATA MFG CO LTD
View PDF9 Cites 22 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the conventional process, however, when the via-holes are filled with the electrically conductive paste, unsuccessful filling including insufficient filling or excessive filling will occur, cracks and elevations of the conductive metal (the sintered conductive metal powder

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same
  • Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

) Preparation of Electrically Conductive Paste

An electrically conductive paste, as a comparative example, that does not belong to the present invention was prepared as in the Example except that coating of the crystalline cellulose powder on the copper powder was not performed.

2) Production of Monolithic Ceramic Substrate

A monolithic ceramic substrate was prepared as in the preferred embodiment except that the electrically conductive paste prepared in procedure 1 and not belonging to the present invention was used.

Evaluation

The monolithic ceramic substrates of the Example and the Comparative Example were cut, and the cut faces were observed with a stereoscopic microscope to check for cracks and elevations of the conductive metal and cracks of the ceramic. The results are shown in Table 1.

The surfaces of the Ni plating films formed on the conductive metal surface in the via-hole of the monolithic ceramic substrates of the Example and the Comparative Example were observed with a scann...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Percent by massaaaaaaaaaa
Percent by massaaaaaaaaaa
Percent by massaaaaaaaaaa
Login to view more

Abstract

As an electrically conductive paste for via-holes, an organic vehicle and an electrically conductive metal powder coated with a resin which is insoluble in the organic vehicle are prepared. Filling via-holes with the electrically conductive paste for via-holes produces a monolithic ceramic. Filling characteristics of the electrically conductive paste into via-holes are improved, and cracks and elevations of the conductive metal and cracks of the ceramic barely form during the baking step. Further, the resulting monolithic ceramic substrate can maintain excellent soldering wettability and plating characteristics.

Description

1. Field of the InventionThe present invention relates to an electrically conductive paste for a via-hole and a method of producing a monolithic ceramic substrate using the same, and particularly, relates to an electrically conductive paste for filling a via-hole formed in a green ceramic sheet and a method of producing a monolithic ceramic substrate comprising filling via-holes with the electrically conductive paste.2. Description of the Related ArtA monolithic ceramic substrate has been known in which green ceramic sheets provided with electrodes and circuits are laminated and the electrodes and circuits formed on these sheets are electrically connected with via-holes.The monolithic ceramic substrate is fabricated by the following steps. Via-holes are formed in green ceramic sheets with a drill or punch and filled with an electrically conductive paste containing an electrically conductive metal powder. Electrodes and circuits are formed on surfaces of the green ceramic sheets by a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/48H01L23/498H01L21/02H01L23/48H05K1/09H05K3/40H01B1/00H01B1/16H01B1/22H05K3/46
CPCH01L21/486H05K1/092H01L23/49883Y10T428/24331H05K3/4061H05K3/4629Y10S428/901H01L2924/0002Y10T428/2982Y10T29/49165Y10T428/24322Y10T428/2991Y10T428/24273H01L2924/00
Inventor TANI, HIROJIOHSHITA, KAZUHITO
Owner MURATA MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap