Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device
a semiconductor device and semiconductor technology, applied in the direction of solid-state devices, inductances, instruments, etc., can solve the problems of increasing the area required to provide the inductors, increasing the size of the pads and the pitch between the pads, and increasing the difficulty of achieving a sufficient electrical connection
Inactive Publication Date: 2011-08-23
RENESAS ELECTRONICS CORP
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- Application Information
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Benefits of technology
The present invention provides a semiconductor device with a power receiving inductor and a signal transmitting / receiving unit that can transmit and receive signals in a non-contact manner through electromagnetic induction or capacitive coupling. The power receiving inductor surrounds the chip internal circuit and signal transmitting / receiving unit, allowing for sufficient power supply without increasing chip size. The semiconductor device can be manufactured with a smaller chip size and can be connected to an external device through non-contact methods. The semiconductor device can also be connected to an external power supply circuit through a bonding wire. The invention also provides a method for manufacturing the semiconductor device.
Problems solved by technology
There arises a problem in that, for example, damage is caused to the pad by the probe during a probe test, which later leads to a poor connection in the case of bonding the pad, or in that the pad is scraped and small pieces are removed, which causes contamination.
Moreover, along with a reduction in chip size and an increase in pads per one chip, a pad size and a pitch between the pads have been reduced, and hence it has become increasingly difficult to realize a sufficient electrical connection through application of a number of probes corresponding to a number of pads.
However, in order to transmit / receive various signals to / from the internal circuit by, for example, electromagnetic induction instead of a plurality of pads to correspond to input / output signals to the plurality of pads, a large number of inductors are necessary, which increases an area required to provide those inductors.
On the other hand, for supplying the internal circuit with power, large electromagnetic force is required.
With the structure described above, the signal transmitting / receiving unit can be formed to be smaller than the power receiving inductor to be provided inside the power receiving inductor, with the result that an increase in chip size can be limited even when a plurality of the signal transmitting / receiving units are arranged.
Method used
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Embodiment Construction
[0051]Hereinafter, an embodiment of the present invention is described with reference to the drawings. It should be noted that similar components are denoted by similar reference numerals in the respective drawings, and their descriptions are appropriately omitted. In this embodiment, a description is given of a case where, as an example, when a test is run on a chip internal circuit provided within a semiconductor device at a wafer level, various test signals are transmitted / received to / from an external tester in a non-contact manner, and at the same time, the semiconductor device is supplied with a power supply voltage in the non-contact manner.
[0052]FIG. 1 is a plan view illustrating a structure of a semiconductor device 100 according to this embodiment.
[0053]The semiconductor device 100 includes a semiconductor substrate 101. A plurality of semiconductor chip formation regions 102 and a scribe line region 104 provided around the semiconductor chip formation regions 102 are forme...
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A semiconductor device (100) including: a semiconductor substrate including a semiconductor chip formation region (102); a chip internal circuit (124); a signal transmitting / receiving inductor (114) which transmits / receives a signal to / from an outside in a non-contact manner by electromagnetic induction, and transmits / receives a signal to / from the chip internal circuit (124) through electrical connection to the chip internal circuit (124); and a power receiving inductor (112) which has a diameter provided along an outer edge of the semiconductor chip formation region (102) so as to surround the chip internal circuit (124) and the signal transmitting / receiving inductor (114), receives a power supply signal from the outside in the non-contact manner, and is electrically connected to the chip internal circuit (124). Accordingly, power supply can be sufficiently made in the non-contact manner while limiting an increase in chip size when various signals are transmitted / received in the non-contact manner.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a semiconductor device, a method of manufacturing the same, and a signal transmitting / receiving method using the semiconductor device.[0003]2. Description of Related Art[0004]These days, a semiconductor device which communicates data by radio communication is known.[0005]JP 2007-134694 A describes a semiconductor device which communicates data by electromagnetic induction. The semiconductor device includes a coiled antenna and a semiconductor integrated circuit connected to the coiled antenna. When the coiled antenna connected to a reader / writer is brought close to the semiconductor device, an AC magnetic filed is generated from the coiled antenna connected to the reader / writer. The generated AC magnetic field passes through the coiled antenna contained in the semiconductor device, and an electromotive force is generated between terminals of the coiled antenna by electromagnetic inductio...
Claims
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IPC IPC(8): H01L29/82H10N97/00
CPCG01R31/2886H01L28/10G01R31/303G01R31/3025
Inventor NAKASHIBA, YASUTAKA
Owner RENESAS ELECTRONICS CORP