Printed wiring board and wireless communication system
a wireless communication system and wiring board technology, applied in the direction of printed circuit non-printed electric components, semiconductor/solid-state device details, instruments, etc., can solve the problem that the radiation characteristic of a high-frequency signal is not necessarily good, and achieve the effect of improving the radiation characteristic (radiation gain and directivity) of a high-frequency signal, simple configuration, and excellent radiation characteristi
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first preferred embodiment
[0031]As illustrated in FIG. 1, a printed wiring board 1A according to a first preferred embodiment of the present invention includes a circuit substrate 11 in which two insulating sheets 11a and 11b (and a plurality of sheets not illustrated, if necessary or desired) are laminated. On the sheet 11a, first planar conductors 21a and 21b and second planar conductors 22a and 22b are located, and the terminal electrodes of a wireless IC element 50 are electrically connected to ends of the first planar conductors 21a and 21b, which face each other. A radiator 31 having a wide area is located on the sheet 11b.
[0032]The other end portions of the first planar conductors 21a and 21b and two corner portions of the radiator 31 are electrically connected to each other through via hole conductors 32a and 32b. A loop-shaped electrode 20 is defined by the first planar conductors 21a and 21b, the via hole conductors 32a and 32b, and one side of the radiator 31. The second planar conductors 22a and...
second preferred embodiment
[0039]As illustrated in FIG. 2, a printed wiring board 1B according to a second preferred embodiment includes a circuit substrate 11 in which two insulating sheets 11a and 11b (and a plurality of sheets not illustrated, if necessary) are laminated. On the sheet 11a, first planar conductors 21a and 21b are located, and the terminal electrodes of the wireless IC element are electrically connected to ends of the first planar conductors 21a and 21b, which face each other. On the sheet 11b, a radiator 31 having a wide area and third planar conductors 23a and 23b are located.
[0040]The other end portions of the first planar conductors 21a and 21b and two corner portions of the radiator 31 are electrically connected to each other through via hole conductors 32a and 32b. A loop-shaped electrode 20 is defined by the first planar conductors 21a and 21b, the via hole conductors 32a and 32b, and one side of the radiator 31. The third planar conductors 23a and 23b extend from both end portions of...
third preferred embodiment
[0044]As illustrated in FIG. 3, a printed wiring board 1C according to a third preferred embodiment includes a circuit substrate 11 in which two insulating sheets 11a and 11b (and a plurality of sheets not illustrated, if necessary) are laminated. On the sheet 11a, first planar conductors 21a and 21b and fourth planar conductors 24a and 24b are located, and the terminal electrodes of the wireless IC element 50 are electrically connected to ends of the first planar conductors 21a and 21b, which face each other. On the sheet 11b, a radiator 31 having a wide area and fifth planar conductors 25a and 25b are located.
[0045]The other end portions of the first planar conductors 21a and 21b and two corner portions of the radiator 31 are electrically connected to each other through via hole conductors 32a and 32b. A loop-shaped electrode 20 is configured using the first planar conductors 21a and 21b, the via hole conductors 32a and 32b, and one side of the radiator 31. The fourth planar condu...
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