7results about How to "Reduce physical distance" patented technology

Embodiments of the present application disclose a method and device for on-chip interconnection. In the embodiments of the present application, a physical unit is routed according to port wiring rules of the physical unit to obtain a port wiring scheme of the physical unit, and the port wiring scheme of the physical unit is checked, and then a register transfer level of the physical unit is generated according to the port wiring scheme after it is determined that the port wiring scheme passes the wiring check. In the embodiments of the present application, the port wiring rules of the physical unit are determined according to a logical connection relationship of the physical unit, a type number and a wiring capacity of each internal module in the physical unit, so that the embodiments of the present application can reduce the wiring number in the physical unit by reducing the type number and the capacity of the internal module, thereby reducing the chip area, shortening the physical distance of a critical path and signal transmission delay, reducing the wiring congestion, and improving the chip performance.

The utility model discloses a Mylar film structure for aluminum shell battery, aluminum shell battery and electronic product belong to battery technical field, including Mylar film body, Mylar film body includes first cladding piece, second cladding piece and the connecting cladding piece of first cladding piece and second cladding piece are connected respectively, recesses is formed in first cladding piece and is used to store the first liquid storage groove of electrolyte, recesses is formed in second cladding piece and is used to store the second liquid storage groove of electrolyte, first liquid storage groove and second liquid storage groove all are located on the side surface of battery roll core. The utility model reaches the technical effect of improving diffusion efficiency, and promotes the long -term cycle performance of battery.

This utility model belongs to the field of computing cluster deployment technology, and discloses a computing cluster system, including at least one row of computing cluster structures. Each computing cluster structure includes at least one computing cluster component, which comprises a first and a second cabinet arranged back-to-back, and an assembly mezzanine component disposed between them. The assembly mezzanine component includes a fixed frame and high-speed cable connection groups, power distribution cable connection groups, and liquid cooling pipe connection groups disposed within the fixed frame. The high-speed cable connection groups connect to the first and second cabinets for interconnection between the two cabinets; the power distribution cable connection groups connect to the first and second cabinets for power supply; and the liquid cooling pipe connection groups connect to the first and second cabinets for coolant supply. This computing cluster system can achieve a reasonable layout to improve space utilization, manage cables, shorten interconnection cable lengths, and optimize maintenance efficiency.

The utility model discloses a connector, an electric control device and heating and ventilation equipment, the connector comprises an insulating seat and a power connection column, the insulating seat is arranged in a shell, the power connection column is arranged in the insulating seat, the power connection column is provided with two power connection end parts connected with each other, the tail end of each power connection end part is provided with a power connection convex part, and the power connection convex part is arranged in the shell. Each power connection protruding part protrudes out of the peripheral side of the power connection column in the radial direction of the power connection column, and the two power connection protruding parts are connected between the first circuit module and the second circuit module so that the first circuit module and the second circuit module can be electrically connected. Thus, compared with an electric control device in the related technology, the insulating seat and the power connection column of the connector can be installed in the shell in advance, the connecting position in the connector is limited through the insulating seat, an operator only needs to make the first circuit module and the second circuit module be in butt joint with the two power connection protruding parts, and then the wiring process can be completed; therefore, the wiring difficulty of the electric control device of the heating and ventilation equipment is reduced, and the error rate is low.

This utility model provides a liquid collection cup with cleaning and purging functions, relating to the field of wafer manufacturing technology. It includes: a collection cup body; a cleaning and purging integrated component installed at the cup opening; an air inlet and a water inlet of the cleaning and purging integrated component connected to an air inlet pipe and a water inlet pipe, respectively; and an air outlet and a water outlet of the cleaning and purging integrated component facing the central axis of the collection cup body. The beneficial effect is that by integrating the cleaning layer and the purging layer into the cup opening of the collection cup body, the cleaning water flow and the purging airflow are directly sprayed towards the central axis of the collection cup. This design significantly shortens the physical distance between the cleaning / purging component and the nozzle. After the nozzle returns to its original position, residual liquid can be removed and the nozzle surface dried simultaneously through the integrated cleaning and purging action. This avoids the space redundancy of traditional split structures and significantly improves cleaning efficiency and chamber cleanliness.

The utility model relates to the technical field of semiconductor packaging, specifically relates to a kind of photoelectricity co-encapsulation new packaging structure based on glass core carrier plate;Glass core substrate adopts double-layer structure, and the horizontal copper interconnection distance is shortened by vertical interconnection technology;Silicon-based chip is mounted on glass core substrate and is connected with photonic chip and light source through copper bump with high efficiency, while substrate dielectric layer is accurately made through exposure development plating process, reducing the loss in signal transmission path;Photonic chip and light source are directly integrated on the second glass core, further shorten the physical distance with digital chip, cooperate with the pressing connection process of ABF material, significantly improve signal transmission efficiency and reduce energy consumption, to meet the high-speed data transmission demand, promote the further improvement of semiconductor equipment performance.

The application relates to a methanol engine knock suppression and protection device, which comprises an engine body, an air inlet pipe connected with the engine body, and a back gas pipeline connected with the engine cylinder; the back gas pipeline is provided with a cooling mechanism, the cooling mechanism comprises a cooling pipeline arranged on the back gas pipeline, an air passage pipeline assembly for controlling the air passage direction, and a heat transfer mechanism for cooling through heat transfer; the air passage direction is changed through the air passage pipeline assembly, and cooling is realized through cooperation with the transmission protection mechanism. Under the non-knock working condition, the magneto-rheological fluid is in a liquid state after power-off, the air nozzle remains absolutely horizontal and straight, the memory alloy ring is not protruded and adheres to the wall, and the fuel economy of the engine is ensured; the air nozzle is turned over and the wall alloy ring is protruded, so that strong directional turbulent flow is generated, and the bottleneck of low gas heat exchange efficiency is broken from the bottom logic of aerodynamics.