LGA 775 socket producing process and fixing apparatus

Abstract

The present invention is LGA 775 socket making process and fixture. The LGA 775 socket making process includes assembling terminals to the socket body of plastic, covering the dust cap onto the socket body, welding the socket body with dust cap on the mainboard, combining metal support and fixing sheet mechanically from the upper and the lower sides of the mainboard, and fixing the socket onto the mainboard.

Description

Technical field [0001] The present invention relates to an assembly process of a high-end central processing unit (CPU), in particular to a manufacturing process of an LGA775 (flat matrix welding of 775-pin terminals) socket (an electrical connector socket with a notch). The welding of the terminals in the socket and the force that is clamped on the motherboard are more uniform, so as to reduce the phenomenon of main body breakage, and the manufacturing process is smoother and faster. Background technique [0002] Generally, the process of making LGA multi-pin sockets, such as LGA775 sockets, is shown in Figure 7. The production process is: [0003] 1. Assemble the socket body to the terminal (B1): Insert the required terminal 61 into the terminal hole 601 of the manufactured socket body 60, and apply ball grid array (BGA) soldering to the bottom of the terminal 61. [0004] 2. Combining the main body with the metal frame (B2): The way of coupling is to provide the socket body 60...

AI Technical Summary

Problems solved by technology

[0011] However, the above-mentioned existing manufacturing process is not perfect, so it often has the following shortcomings in production:

[0012] 1. Please refer to Figure 7. In the manufacturing process, the socket body 60 and the supporting metal frame 62 are hot-melted and embedded, and two different materials, one soft and one hard, are joined and fixed. Technically It is more difficult, and heating, fusion and cooling require a long waiting time, and more expensive equipment is required, so the cost is higher, and the procedure is complicated, which is the shortcoming extended by the existing technology

[0013] 2. The supporting metal frame 62 of the outer cover 621 has a certain weight, and the suction force of the vacuum nozzle is limited. Therefore, during the manufacturing process, the vacuum nozzle is aligned with the center of the dust-proof cover to suck up the entire set of sockets (B5) During the program, if the suction position of the suction nozzle is slightly deflected (because the position of the conveyor belt is not easy to control), because the supporting metal frame 62 itself is very heavy, when its center of gravity is not at the same point as the suction nozzle, it will cause A considerable tilt component will cause the entire set of sockets to slip off from the nozzle, or the position will deviate resulting in defective products. This is an uncontrollable defect in the existing process.

[0014] 3. Please refer to Figure 8, the socket soldered by the conventional process, due to the gravity of the socket body 60, the supporting metal frame 62 and the chip, is supported by the solder 81 under the terminal 61, if there is an external force bumping or pushing it to When supporting the metal frame 62, a shear force V will be generated between the supporting metal frame 62 and the circuit board 80, which will destroy the structure of the solder ball 81 and cause damage to the terminal 61 and the electronic path, which is the main shortcoming of the prior art

[0015] 4. Referring to Fig. 8 again, when the outer cover 621 of the supporting metal frame 62 utilizes elastic force against the top of the chip and the socket body 60, its clamping force P is very large. As mentioned above, due to the above-mentioned clamping The force is all borne by the solder ball 81 on the terminal 61, and it is also easy to deform the socket body 60 made of plastic, and often cause the terminal hole to crack. This is another major shortcoming of the prior art

[0016] 5. Based on the above, if any part of the socket body 60, terminal 61 or supporting metal frame 62 is damaged, or if there is a poor contact in the welding, it cannot be repaired locally, but can only be replaced as a whole group, so that the local defect rate is The damage of the whole group, which is another shortcoming of the prior art

[0017] Therefore, when developing LGA multi-pin sockets, the convenience of manufacturing and the problem of future maintenance should be considered at the same time. Since the current precision terminals are very small and fragile, it is necessary to avoid the use of the entire set of parts due to small missing parts in the manufacturing process. Consider whether it has the convenience of maintenance; at the same time, it is best to consider reducing the cost of precision machinery in manufacturing in order to create low-cost and high-quality products

Images