Etching device for high precision silicon senser chip

A sensor chip and corrosion device technology, applied in microstructure devices, manufacturing microstructure devices, decorative arts, etc., can solve problems such as easy undercutting, high requirements on process operations, long processing time, etc., and achieve a high degree of centralized control. , Improve the quality of the reaction, speed up the effect of the reaction process
CN100347829CInactive Publication Date: 2007-11-07SHENYANG ACAD OF INSTR SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENYANG ACAD OF INSTR SCI
Publication Date
2007-11-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

The equipment includes industrial control computer, electric appliance control cabinet, reaction chamber, KOH stock solution pot and cleaning liquid stock solution pot. The computer including CRT touch screen and job control program through communication interface is connected to control circuit of electric control cabinet, reaction chamber as well as valves and pumps on pipe. Transmission sprinkle mechanism is built in reaction chamber, and sprinkle tube through liquid pipe is connected to immersible pumps in KOH stock solution pot and cleaning liquid stock solution pot. Probes for detecting temp and density of KOH are setup in the reaction chamber. Computer control is adopted in the equipment. Thus simple operation and production in scale (six wafers in four inches in one time) are realized. Sprinkle technique makes etching process in better environment of washing out and reacting. The suitable wafer to be etched includes all wafers with diameters smaller than 110mm.
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Description

[0001] Field

[0002] The invention relates to an etching device for a silicon chip used in a wet chemical etching process for a silicon sensor. Background technique

[0003] The silicon sensor etching device is one of the key equipment in the batch silicon sensitive diaphragm preparation process in the sensor MEMS micromachining manufacturing technology. Its mechanism is to conduct directional etching on the surface of silicon wafers through wet chemical etching process to achieve the purpose of mass production of silicon sensor sensitive diaphragms.

[0004] There are no domestic and foreign reports related to the "high-precision silicon wafer etching device", but the simple device and etching process technology for forming the required silicon diaphragm by means of wet chemical etching are well known both at home and abroad. There are many articles on it. In the past, some simple and related silicon wafer etching devices were prepared for the needs of scientific research,...

Claims

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