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System and method for bending a substantially rigid substrate

A substrate and bending technology, applied in the direction of circuit substrate materials, printed circuits connected with non-printed electrical components, printed circuits, etc., can solve problems such as increased fracture and splitting

Inactive Publication Date: 2007-11-21
MOTOROLA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although FR4 and other more rigid substrates are considerably less expensive to manufacture than very flexible substrates, the use of stiffer substrates presents an increase in fracture and splitting when attempting to bend the substrate into a confined space The problem

Method used

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  • System and method for bending a substantially rigid substrate
  • System and method for bending a substantially rigid substrate
  • System and method for bending a substantially rigid substrate

Examples

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Embodiment Construction

[0028] Referring now to the drawings, an example use of the apparatus and method will be explained in the context of an arrangement for an electronic control unit of a vehicle. Figures 1 and 2 show opposite sides of an example circuit board 20 located in an electronic control unit. In one embodiment, generally, the circuit board 20 has a substantially rigid substrate 22 , a first stiffener portion 24 and a second stiffener portion 26 . The substantially rigid substrate 22 has a first portion 28 and a second portion 30 interconnected by a bend 32 . The substantially rigid substrate 22 may be made of FR4 or other relatively rigid organic substrates. FR4 is a material with at least one layer of glass texture impregnated with epoxy resin. Other types of glass epoxy and polyimide are also commercially available. The substantially rigid substrate 22 may also be formed from multiple layers of substrate material laminated together, making the substrate more rigid or brittle. Altho...

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Abstract

A system and method for bending a substantially rigid substrate (22) having a first and second portions (28, 30) interconnected by a bend region (32) and first and second heated die members (60). The first heated die member (60) has a longitudinal body portion (62) and an outer edge portion (64) that extends along the longitudinal body portion (62) and is substantially rounded. The second heated die member (80) has a longitudinal body portion (82) and a groove (84) that extends along the longitudinal body portion (82). The heated die members (60) are configured to contact the substrate (22) and are capable of bending the substrate (22) in the bend region (32) when the outer edge portion (64) of the first heated die member (60) slides into the groove (84) of the second heated die member (80).

Description

technical field [0001] The present invention relates generally to bending substantially rigid substrates for use in electronic control units, and more particularly to methods and apparatus for bending substrates by localized heating by various mechanisms. Background technique [0002] Engine-mounted electronic control units for vehicle engines are exposed to high levels of heat and vibration and are typically located in a confined space. In these applications, electronic components and circuits can be formed on thinner substrates enclosed in a rigid housing. To enhance thermal performance against engine vibrations, the thin substrate is fixed to a stiffener section that can be bent to create a reduced-size module, which also acts as a heat spreader. [0003] For example, one type of direct engine mount application uses a PolybentTM printed circuit board. This is a printed circuit board with a flex mounted on an aluminum hardener part. The stiffener portion provides mechan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C53/04H05K1/03H05K1/18H05K3/00
CPCH05K3/0061H05K3/0014H05K2203/1105B29C53/04H05K1/189H05K1/0366H05K2203/0195H05K2201/2009H05K2203/302
Inventor 大卫·菲德勒大卫·W·屈里埃贺瑞斯·M·隆詹姆士·V·洛厄里
Owner MOTOROLA INC
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