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System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold

A drying system and meniscus technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of reducing the qualified rate of qualified wafers and increasing the cost of semiconductor wafers, so as to improve drying and cleaning processes and reduce residues Effects of pollutants, reducing fluids and contamination

Inactive Publication Date: 2007-11-21
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such deposition, which occurs frequently today, reduces the yield of good wafers and increases the cost of manufacturing semiconductor wafers

Method used

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  • System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
  • System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
  • System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold

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Embodiment Construction

[0099] Inventions of methods and apparatus for cleaning and / or drying wafers are disclosed. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be understood, however, to one skilled in the art that the present invention may be practiced without some or all of these details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.

[0100] Although the invention has been described in terms of several preferred embodiments, it should be understood that various changes, additions, substitutions and equivalents thereof will be enabled to those skilled in the art after reading the foregoing description and studying the accompanying drawings . Accordingly, the present invention is intended to cover all such changes, additions, substitutions and equivalents that fall within the basic spirit and scop...

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PUM

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Abstract

An apparatus and method for processing a wafer is provided. The system and method are designed to process a surface of a wafer using a meniscus. The meniscus is controlled and is capable of being moved over the surface of the wafer to enable cleaning, rinsing, chemical processing, and drying. The apparatus can be defined using a number of configurations to enable specific processing of the wafer surface using the meniscus, and such configurations can include the use of proximity heads.

Description

technical field [0001] The present invention relates to the processing, cleaning, and drying of semiconductor wafers, and more particularly, to apparatus and techniques for more efficiently adding and removing fluids from wafer surfaces while reducing contamination and wafer processing costs. Background technique [0002] In the semiconductor chip manufacturing process, it is known that a wafer subjected to a manufacturing process that leaves undesirable residues on the surface of the wafer needs to be cleaned and dried. Examples of such fabrication processes include plasma etching (eg, tungsten etch back (WEB)) and chemical mechanical polishing (CMP). In CMP, a wafer is placed in a fixture that holds the surface of the wafer against a rolling conveyor belt. The belt is polished using a slurry consisting of chemical and abrasive materials. Unfortunately, this process tends to leave a deposit of slurry particles and residues on the wafer surface. If undesired residual mate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
CPCH01L21/67028H01L21/67034H01L21/67051H01L21/02H01L21/304
Inventor 卡尔·武德詹姆士·P·加西亚约翰·的拉芮奥麦克·拉夫金佛瑞德·C·瑞德克阿夫辛·尼克宏
Owner LAM RES CORP