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Robot arm with specimen edge gripping end effector

A technology of end effectors and test pieces, applied in the direction of manipulators, mechanical equipment, chucks, etc., can solve problems such as wafer processing damage

Inactive Publication Date: 2008-03-05
NEWPORT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Reducing this contamination is especially important to maintain wafer processing productivity, and transferred wafers may be scratched or worn on the backside, resulting in wafer processing damage

Method used

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  • Robot arm with specimen edge gripping end effector
  • Robot arm with specimen edge gripping end effector
  • Robot arm with specimen edge gripping end effector

Examples

Experimental program
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Effect test

Embodiment Construction

[0034] 1 and 2 show a spatula-shaped end effector 10 of a first example embodiment of the present invention, which can be used to return a semiconductor wafer, such as a wafer 12 (shown transparent to show the underlying structure), back to a wafer cassette 14 or from a wafer Take it out of box 14. End effector 10 is adapted to receive and securely hold wafer 12 and transfer it to cassette 14 or remove it for processing. End effector 10 shown in FIG. 2 is particularly suitable for removing and replacing closely spaced wafers stacked in wafer cassette 14, such as wafers 12, 12A and 12B. Wafers with a diameter of less than 150 mm are usually spaced at a pitch of 4.76 mm (3 / 16 inch); wafers with a diameter of 200 mm are usually spaced at a pitch of 6.35 mm (1 / 4 inch); wafers with a diameter of 300 mm are usually spaced at a pitch of 10 mm (0.394 inch).

[0035] End effector 10 is operably connected to manipulator 16 (only a portion of which is shown) which can be programmed by ...

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PUM

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Abstract

Robot arm (16) end effectors (10, 110) of this invention rapidly and cleanly transfer between a wafer cassette (14) and a processing station semiconductor wafers (12) having diameters greater than 150 mm. The end effectors include proximal and distal rest pads (24, 26, 124,126) having pad and backstop portions (32, 34, 132, 134) that support and grip the wafer within an annular exclusion zone (30) that extends inward from a peripheral edge (30) of the wafer. An active contact point (50, 150) is movable by a vacuum actuated piston (52, 152) between a retracted wafer-loading position and an extended position that urges the wafer against the distal rest pads to grip the wafer within the exclusion zone. The end effector further includes fiber optic light transmission sensors (90, 102, 202) for locating the wafer periphery and bottom surface (100, 200). The sensors provide robot arm extension and elevation positioning data supporting methods of rapidly and accurately placing and retrieving a wafer from among a stack of closely spaced apart wafers stored in the wafer cassette. The methods effectively prevent accidental contact between the end effector and the wafers while effecting clean, but secure, gripping of the wafer at its edge or within its exclusion zone.

Description

technical field [0001] The present invention relates to a device and method for clamping a test piece, more particularly, to a manipulator end effector for clamping the edge of a semiconductor wafer, which can greatly reduce damage and particle contamination on the back of the wafer. Background technique [0002] Integrated circuits are made from wafers of semiconductor material. Wafers are usually housed in a box that has a number of closely spaced slots, each slot holding a wafer. Cassettes are typically transported to a processing station where wafers are removed, placed in a predetermined orientation with a pre-aligner, or processed, and returned elsewhere for further processing. [0003] Various wafer handling devices are used to place wafers in and out of cassettes and transport them between processing stations. Many occasions use a manipulator whose spatula-shaped end is inserted into the cassette to take out or place wafers. The end of the manipulator is called an ...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/677H01L21/67B65G49/07B25J15/08H01L21/683
CPCY10S414/141H01L21/68707Y10S700/90Y10T74/20317H01L21/68H01L21/6838
Inventor P·巴基P·菲利普斯基
Owner NEWPORT CORP
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