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Printed circuit board

A printed circuit board and hybrid integrated circuit technology, which is applied to printed circuit components, lighting and heating equipment, household appliances, etc., can solve the problem of increasing the overall area of ​​the circuit board and the area occupied by the second device 3. Board size, etc.

Inactive Publication Date: 2008-03-19
LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] But, the circuit board of the electrical product of the prior art as mentioned above, because many parts such as resistor, diode or capacitor etc. are combined by soldering on one substrate 1, so can increase the area that is equivalent to part necessary, can simultaneously Increase the size of the circuit board, so that the size of various electrical products on the circuit board also becomes large
Especially on the refrigerator C1, the mover (not shown) is used to reciprocate along a straight line, and the piston (not shown) combined with the mover is also inside the cylinder (not shown), along the inside, along the The reciprocating compressor that reciprocates linearly has the problem of increasing the area occupied by the second device 3 in order to satisfy the characteristics of the reciprocating compressor that precisely controls the torque of the piston, resulting in an increase in the overall area of ​​the circuit board.

Method used

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  • Printed circuit board
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Embodiment Construction

[0020] The printed circuit board of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments:

[0021] As shown in Figure 3, the circuit board of the present invention is formed by conductors on one side or both sides (one side in the figure) to form the bottom line, and various components that can control product ① and product ② are combined on the bottom line Main board 11, is connected with main board 11 through processing and forms with the hybrid integrated circuit 12 that controls product ① and product ② (product ② in the figure) jointly with various parts of main board 11.

[0022] On one side or both sides of the main board 11 of the substrate formed by phenol resin or epoxy resin, a metal film is plated, and a single-layer or multi-layer bottom line is formed by etching in a certain pattern on one side or both sides of the substrate, Simultaneously, the first device 11a for controlling the p...

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Abstract

A printed circuit board is plated with metal film at one or both side of base plate made of phenol resin or expoxy resin, single layer or multilayer bottom line is formed by etching in certain mode on one or both side of base plate, circuit including active cmponent is fabricated with film combining with mainboard for refrigerator control or a part of compressor control component on the bottom line, integrated circuit which is mainly of passive component is attached on the circuit to form mixture integrated circuit being connected with the mainboard.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to reduce the size of the printed circuit board for installing various electrical products by reducing the area of ​​the main board. Background technique [0002] Generally speaking, there are printed circuit boards that control various functions on refrigerators with refrigeration devices or various electrical products, referred to as circuit boards for short. The circuit board is usually coated with a metal film on one or both sides of a substrate formed of phenol resin or epoxy resin, and etched in a certain pattern on one or both sides of the substrate to form a single-layer or multi-layer The bottom line, and then solder various components such as resistors, diodes or capacitors on the bottom line. [0003] As shown in Figure 1, the circuit board of prior art is the substrate 1 that is made of quadrangular plate body; The first device 2 that is arranged on the upper side of substrate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02F25D29/00
Inventor 全荣焕申东熙裴奎钟李右根
Owner LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD