Heat sink for ball single array packaged chip and its application

Abstract

This invention discloses a heat sink of ball single-array packaged chip including at least one metal radiator with electric attribute as the power supply or as the earth at the CB surface layer, one metal radiator covers the supply pin or the earth pin of the packaged chip. A combination device of the ball single array package chip and the CB is also disclosed including: a ball single array package chip at the surface of the CB and having at least a set of pins with the same electric attribute, at least a metal radiator with one part exposed at the CB surface, the other part extends between the chip and the CB and covers a set of pins with the same electric attribute.

Description

technical field

[0001] The invention relates to a heat dissipation technology for a high-power chip, in particular to a heat dissipation device for a BGA (Ball Grid Array Package) chip and a combination of a ball grid array package chip and a printed circuit board. Background technique

[0002] With the continuous improvement of chip integration, the number of I / O (Input / Output, input / output) pins has increased sharply, power consumption has also increased, and the requirements for integrated circuit packaging have become more stringent. More and more chips adopt a BGA (Ball Grid Array Package) structure to realize complex functions. Chips designed in the form of BGA packages have a large number of pins and can perform complex functions. In order to realize these complex functions, the chip needs to consume more current when working, so a lot of heat will be generated inside. In order to ensure the normal operation of the chip, the chip needs to dissipate heat in time, oth...

Examples

no. 1 example

[0041] First embodiment: figure 1 A part of the chip pin arrangement diagram of a BGA chip is given in . This BGA chip 11 has four rows of pins. Among them, pins 1, 2, and 3 are power supply pins whose attribute is power; pins 4, 5, and 6 are ground pins whose attribute is ground; other black pins are signal pins of the BGA chip. Because the copper wires connecting the signal pins are too much and other processing will generate noise and affect the signal transmission quality, so the signal pins for transmitting signals cannot be used for heat dissipation, and the power pins and ground pins only have specific electrical properties, so A heat sink can be added around it to dissipate the heat inside the chip. On the PCB 7 , the signal pins provide electrical signals to the outside through dotted lines. The BGA chip 11 has a definite package size on the PCB 7, and all pins are within the package size.

[0042] figure 1 Among them, the pins 1, 2, and 3 whose attribute is powe...

no. 2 example

[0045] The second embodiment: with figure 2 shown as an example. The BGA chip 11 has four rows of pins. Among them, pins 1, 2, and 3 are power supply pins whose attribute is power supply; pins 4, 5, and 6 are ground pins whose attribute is ground; other black pins are signal pins of BGA chip; marked in the figure 15 is a via. On the PCB 7 , the signal pins provide electrical signals to the outside through dotted lines. The BGA chip 11 has a definite package size on the PCB 7, and all pins are within the package size. This embodiment describes the process of connecting the large-area copper sheet on the surface layer of the PCB to the power layer of the PCB through via holes to dissipate heat. Since the process of connecting the large-area copper sheet whose electrical property is the ground on the surface layer of the PCB to the ground layer through the via hole can be derived accordingly, it will not be repeated here.

[0046] figure 1 Among them, the pins 1, 2, and 3 ...

technical field

[0001] The invention relates to a heat dissipation technology for a high-power chip, in particular to a heat dissipation device for a BGA (Ball Grid Array Package) chip and a combination of a ball grid array package chip and a printed circuit board. Background technique

[0002] With the continuous improvement of chip integration, the number of I / O (Input / Output, input / output) pins has increased sharply, power consumption has also increased, and the requirements for integrated circuit packaging have become more stringent. More and more chips adopt a BGA (Ball Grid Array Package) structure to realize complex functions. Chips designed in the form of BGA packages have a large number of pins and can perform complex functions. In order to realize these complex functions, the chip needs to consume more current when working, so a lot of heat will be generated inside. In order to ensure the normal operation of the chip, the chip needs to dissipate heat in time, oth...

Examples

no. 1 example

[0041] First embodiment: figure 1 A part of the chip pin arrangement diagram of a BGA chip is given in . This BGA chip 11 has four rows of pins. Among them, pins 1, 2, and 3 are power supply pins whose attribute is power; pins 4, 5, and 6 are ground pins whose attribute is ground; other black pins are signal pins of the BGA chip. Because the copper wires connecting the signal pins are too much and other processing will generate noise and affect the signal transmission quality, so the signal pins for transmitting signals cannot be used for heat dissipation, and the power pins and ground pins only have specific electrical properties, so A heat sink can be added around it to dissipate the heat inside the chip. On the PCB 7 , the signal pins provide electrical signals to the outside through dotted lines. The BGA chip 11 has a definite package size on the PCB 7, and all pins are within the package size.

[0042] figure 1 Among them, the pins 1, 2, and 3 whose attribute is powe...

no. 2 example

[0045] The second embodiment: with figure 2 shown as an example. The BGA chip 11 has four rows of pins. Among them, pins 1, 2, and 3 are power supply pins whose attribute is power supply; pins 4, 5, and 6 are ground pins whose attribute is ground; other black pins are signal pins of BGA chip; marked in the figure 15 is a via. On the PCB 7 , the signal pins provide electrical signals to the outside through dotted lines. The BGA chip 11 has a definite package size on the PCB 7, and all pins are within the package size. This embodiment describes the process of connecting the large-area copper sheet on the surface layer of the PCB to the power layer of the PCB through via holes to dissipate heat. Since the process of connecting the large-area copper sheet whose electrical property is the ground on the surface layer of the PCB to the ground layer through the via hole can be derived accordingly, it will not be repeated here.

[0046] figure 1 Among them, the pins 1, 2, and 3 ...

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